The Hot Take: ASML's monopoly needs get challenged, but not sure if Quantum will just make them invalid. We'll have to wait and see I guess.
Intel has entered high-volume manufacturing using ASML's High NA extreme ultraviolet (EUV) lithography technology for a subset of its Intel Core Ultra Series 3 "Panther Lake" processors, becoming the first company to ship high-volume logic products manufactured with the technology. ASML announced the milestone in an official press release on Wednesday, July 15, confirming that Intel Foundry is running the qualified High NA layers on its Intel 18A process node in Oregon.Go deeper with TH Premium: Chipmaking(Image credit: tsmc)A deeper look at the chipmaking supply chainTSMC's $165 billion U.S. investments examinedChina reportedly reverse-engineers EUV toolChina bets on DUV, as EUV blockade reshapes chipmakingAccording to ASML, Intel is using High NA EUV to pattern selected Intel 18A layers, with products already shipping to customers at yields matched to those achieved on ASML's existing NXE EUV platform. These layers are dual-qualified, meaning the same layer can be exposed on either an existing 0.33 NA NXE scanner or a 0.55 NA EXE scanner, with the resulting wafers being interchangeable.High NA EUV has long been viewed as the successor to today's EUV lithography, promising to extend semiconductor scaling by enabling manufacturers to print smaller, denser circuit patterns that are becoming difficult to achieve with existing tools. Until now, the platform had been confined to R&D work. ASML’s announcement marks the first time High NA EUV has been used to produce and ship a high-volume commercial logic product. Panther Lake, built on the Intel 18A manufacturing process, is spearheading this transition. Rather than replacing the company's entire lithography flow, Intel is applying High NA EUV to specific layers while the remainder of the chip continues to be manufactured using conventional lithography. High NA EUV builds on the same 13.5-nanometer extreme ultraviolet light used by today's scanners but increases the optical system's numerical aperture (NA) — how much light a lens system can collect and focus onto a silicon wafer — from 0.33 to 0.55. The higher value resolves finer features in a single exposure, allowing chipmakers to print smaller patterns with greater precision and process control.This increased resolution is expected to reduce reliance on complex multi-patterning techniques for some of the industry's most demanding layers, thereby simplifying manufacturing and improving feature fidelity. In the long term, these capabilities are expected to support higher transistor densities and improved performance in future processors, particularly as AI workloads continue driving demand for increasingly advanced semiconductor technologies."With increased resolution and better process control, the introduction of High NA EUV marks a substantial development in semiconductor lithography," said ASML President and CEO Christophe Fouquet. "We are proud to play a role in enabling the smaller, denser patterning that will accelerate advancements in AI and other emerging technologies." Intel and ASML have been working towards this milestone for several years. In 2024, Intel completed installation of one of the industry's first commercial High NA EUV lithography systems, the TWINSCAN EXE:5000, at its Hillsboro, Oregon, research and development facility. The company later became the first to qualify ASML's second-generation TWINSCAN EXE:5200B, which increases wafer throughput and overlay accuracy while incorporating an improved EUV light source over its predecessor.While the announcement represents High NA EUV's commercial debut, it does not mean Panther Lake is manufactured entirely using the new lithography platform. Instead, Intel has qualified High NA for selected layers, an approach that mirrors how new lithography generations are typically introduced into advanced semiconductor production before broader adoption across future nodes.Intel Foundry Executive Vice President and General Manager Naga Chandrasekaran said that qualifying the High NA process option on selected Intel 18A product layers enables the company's existing tool fleet to deliver higher manufacturing output while providing flexibility for future process technologies.Panther Lake itself is not a future product. Intel launched Core Ultra Series 3 at CES on January 5, 2026, opened preorders the following day, and put systems on shelves globally from January 27. The Core Ultra X9 378H followed in April alongside the value-tier Core Series 3, code-named Wildcat Lake, and the handheld-focused Arc G3 parts arrived on May 28.The announcement’s statement that the product is shipping to customers refers to wafer flow from the fab into the supply chain, rather than to a product launch. ASML says the two companies will continue working on High NA readiness, with the flexibility to incorporate the technology into future nodes based on customer needs — most immediately, Intel 14A, which Intel has designed to use High NA on a set of its tightest-pitch layers.
Battlefield 6 is set to receive one of its largest post-launch content updates when Season 4 arrives on July 21.Developer DICE is expanding the game's combined-arms gameplay with the long-awaited return of naval combat, introducing player-controllable ships alongside a brand-new multiplayer environment described as ...
Intel is reportedly making a significant change to the manufacturing strategy for its upcoming Nova Lake processor family by shifting the majority of compute tile production back to Intel Foundry.
The Hot Take: Makes sense, especially if China takes Taiwan....
According to the Wall Street Journal (paywalled), Apple agreed to use Intel's U.S. chipmaking plants after White House officials pressured Tim Cook during tariff-relief talks last summer. MacRumors reports: In August 2025, Apple CEO Tim Cook was in Washington to lobby the Trump administration to drop its proposed 100 percent tariff on semiconductor imports -- a levy that would have raised costs across Apple's product line. Apple reportedly secured an exemption after pledging to invest hundreds of billions of dollars in the U.S., although many of those investments were already planned. During the meetings, president Trump and commerce secretary Howard Lutnick are said to have urged Cook to use Intel's fabrication plants to make some of Apple's chips. The link between the tariff talks and the Apple-Intel deal had not been previously reported.
Almost a year later, Trump announced via his Truth Social platform that Apple would begin using Intel-made chips in some products. "We need to design and build our Chips right here in America," the president posted. The news sent Intel shares to record highs. According to a person familiar with the negotiations cited by the WSJ, Apple plans to have Intel make chips for both Mac laptops and iPhones. The report doesn't say which chips or in what volume, and Apple is expected to remain reliant on Taiwan Semiconductor Manufacturing Company, or TSMC, for the majority of its custom silicon.
Read more of this story at Slashdot.
Microsoft is acting further on its promise to fix some of Windows 11's worst annoyances. The company is rolling out changes in the Windows Insider Experimental channel that promise a less cluttered search box that largely eliminates ads, although you'll need to tweak settings to get the best results.
The Hot Take: Linux seems to be hovering and Windows is apparently listening to it's end users Finally. We'll see where this goes.
StatCounter's June 2026 data shows Windows made up 56.55% of global desktop OS usage, dropping Microsoft's share below 60% for the first time in years. Linux, meanwhile, reached 4.39%, "one of its strongest recent showings in the company's desktop OS statistics," reports Linuxiac. From the report: Apple's desktop platforms also remain a major part of the picture. StatCounter lists OS X at 11.89% and macOS at 4.48% for June 2026, meaning Apple's combined desktop presence remains comfortably ahead of Linux in the global chart. Chrome OS follows with 1.21%.
Of course, StatCounter's numbers should be read for what they are: web usage statistics, not a direct count of installed operating systems. The company calculates its Global Stats from page views across websites using its tracking code, analyzing details such as browser, operating system, and screen resolution. In other words, the figures reflect measured web activity rather than the number of machines actually installed worldwide.
Read more of this story at Slashdot.
The Hot Take: We'll have to see, they just keep milking Ai at the cost of liquidating a whole other industry.
The GeForce RTX 50-series desktop graphics lineup has remained unchanged for just over a year now (since the introduction of the RTX 5050), and none of the conversations we've had at major trade shows suggests that a mid-cycle Super refresh will occur any time soon. But there are still signs that such an update could still happen at some point, and the latest sign comes from Seasonic, which has listed an RTX 5080 Super, an RTX 5070 Ti Super, and RTX 5070 Ti Super in its PSU wattage calculator. Go deeper with TH Premium: GPUs(Image credit: Noctua)Desktop RoadmapEnterprise RoadmapRubin in-depthThe Stout Owl: The ultimate Noctua G2 PCYou can click through the calculator and assemble a hypothetical system with these unannounced products inside. To be useful, this calculator also provides board power numbers for these as-yet-unreleased cards, and that gives us another bit of juicy info. Given that no official specifications for these GPUs exist, it's impossible to say whether these figures are accurate. But it does allow us to speculate a bit on how they might stack up to existing products. Unannounced RTX 50 Super-series TGPsGraphics CardTotal Graphics Power (W)% ChangeRTX 5070250--RTX 5070 Super275*10% RTX 5070 Ti300--RTX 5070 Ti Super350*17%RTX 5080380--RTX 5080 Super415*15% *As listed in Seasonic PSU calculator. Unconfirmed by Nvidia. Seasonic gives this purported RTX 5080 Super a board power of 415W in its calculator, or 15% higher than the existing RTX 5080's 360W envelope. That makes sense, because the RTX 5080's GB203 GPU is already fully enabled, so any Super version of that card would have to lean on higher power limits and more aggressive clock speeds to see any baseline performance benefit. That figure could also partially account for slightly higher power usage from 8 GB more GDDR7 memory on such a card. Past RTX 50 Super-series rumors have suggested that Nvidia will boost VRAM capacity on those products by moving to higher-density GDDR7 modules with 3GB of capacity each. GDDR7's power consumption as part of the overall board picture is relatively small, but more of it will still matter. If Seasonic's figures are accurate, we should also expect a similarly sized TGP increase out of the RTX 5070 Ti Super, whose 350W rating is 17% higher than that of the RTX 5070 Ti. The RTX 5070 Super, meanwhile, gets only a 10% TGP bump over the RTX 5070, from 250W to 275W. Both of these cards rely on GPUs that are slightly cut down from their full available resources, so it's possible that Nvidia could boost their performance through a balance of enabling more Streaming Multiprocessors (SMs) in addition to boosting clocks through higher power envelopes. Beware of extrapolating performance improvements directly from these percentages, though. Our own testing has shown that any real-world performance benefits from these power limit increases are likely to be smaller than those figures would suggest. As our review of the MSI RTX 5090 Lightning Z showed, the largest performance boosts from higher power limits are likely to be concentrated in ray-traced and path-traced games, whose computational intensity is significantly higher than pure raster titles and is more likely to run the GPU into its power limits. In any event, we shouldn't expect to see these products any time soon. Nvidia has instead been focused on getting more out of existing Blackwell silicon with software improvements such as DLSS 4.5 upscaling and Multi-Frame Generation multipliers up to 6X. These technologies enable higher output frame rates and image quality with lower input resolution than past DLSS technologies, and the boost to both performance and image quality from those technologies in tandem has certainly made existing Blackwell products more appealing than they were at launch.But as monitor refresh rates continue to climb thanks to ongoing improvements to OLED and LCD panels, and next-generation HDMI 2.2 connectors looming over 2027, a hardware update of some kind that boosts baseline performance and potentially implements support for those standards seems practical at some point. Given these primarily consumer-focused improvements, an announcement at CES 2027 or Computex 2027 might make sense. As with any future product rumors, however, only time will truly tell.
The Hot Take: Was almost like they were purposefully crippling their processors under past management.
Intel Nova Lake CPUs will mark the return of AVX-512, a feature that has long been abandoned by the company for its client CPUs. AVX-512 Is Coming Back To Intel's Consumer CPUs, Starting With Nova Lake Intel has had a love-hate relationship with AVX-512 on its consumer CPUs. The AVX-512 instruction set was last seen on Intel's Tiger Lake (11th Gen) family, and since then, the company has offered no support for it on its modern-day chips. Meanwhile, AMD has been offering AVX-512 support on its Zen 4 and Zen 5 chips, both client and server platforms. Last year, we […]Read full article at https://wccftech.com/intel-nova-lake-cpus-to-bring-back-avx-512-support-six-years-after-it-was-abandoned/
Intel has published a new patent on its XBM memory, which is proposed as a replacement for HBM4, offering much higher bandwidth capabilities. XBM vs HBM: Intel's New Proposed DRAM Solution Extends To 32 GT/s Speeds, While Reducing Costs Through UCIe Links HBM continues to be the standard for AI accelerators, but more recently, we have seen LPDDR memory being used to overcome shortages, prices, and power associated with the standard. Intel's past attempts at DRAM, such as HMC (Hybrid Memory Cube) and MCDRAM, faced various issues and never came to market, but with XBM, Intel is course-correcting its DRAM […]Read full article at https://wccftech.com/intel-xbm-memory-takes-aim-at-hbm4-32-gt-s-speeds-lower-costs-through-ucie-links/