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NVIDIA Uses 88-Core Vera CPU to Accelerate Next-Generation CPU and GPU Design

The Hot Take: Still not buying the ARM SoC's are better than discrete system CPUs. We'll have to see how Intel/AMD ACE instructions far against this.

NVIDIA has started using clusters of its own Vera processors to develop future CPUs, GPUs, and AI accelerators. The company says initial electronic design automation testing shows performance improvements of up to 1.

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AMD Is Reportedly Pricing Its Helios Rack 40% Above NVIDIA’s Second-Gen Rubin, Confident That Customers Will Pay The Premium

The Hot Take: Will have to take this with a bit rock of salt until we see the benches and real world performance. Just a price grab or actual performance?

AMD is apparently no longer satisfied with being perceived as a perennial underdog, and is reportedly choosing to make a bold statement by pricing its Helios rackscale solution at a hefty premium to NVIDIA's Rubin. What's more, AMD has reportedly managed to rope in Microsoft as the product's first confirmed client, demonstrating the utility that Helios offers even at its supposedly elevated price point. Futurum believes AMD will price Helios at $5 million to $5.5 million per rack, versus an expected retail price of $3.5 million to $4 million for the second-gen NVIDIA Rubin rack As we explained in a […]Read full article at https://wccftech.com/amd-is-reportedly-pricing-its-helios-rack-40-above-nvidias-second-gen-rubin-confident-that-customers-will-pay-the-premium/

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Intel’s XBM Memory Takes Aim At HBM4, Promising 32 GT/s Speeds And Lower Costs Through UCIe Links

The Hot Take: Competition is GOOD.

Intel has published a new patent on its XBM memory, which is proposed as a replacement for HBM4, offering much higher bandwidth capabilities. XBM vs HBM: Intel's New Proposed DRAM Solution Extends To 32 GT/s Speeds, While Reducing Costs Through UCIe Links HBM continues to be the standard for AI accelerators, but more recently, we have seen LPDDR memory being used to overcome shortages, prices, and power associated with the standard. Intel's past attempts at DRAM, such as HMC (Hybrid Memory Cube) and MCDRAM, faced various issues and never came to market, but with XBM, Intel is course-correcting its DRAM […]Read full article at https://wccftech.com/intel-xbm-memory-takes-aim-at-hbm4-32-gt-s-speeds-lower-costs-through-ucie-links/

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Intel Posts Initial GCC Compiler Patches For AI Compute Extensions "ACE"

The Hot Take: I really wonder if this will deflate the Ai bubble even a little bit.

The x86 Ecosystem Advisory Group led by Intel and AMD recently firmed up the AI Compute Extensions (ACE) specification for optimizing x86 for AI computation tasks around matrix multiplication and the like for machine learning workloads. The cross-vendor ACE extension is ultimately a successor to Intel's Advanced Matrix Extensions (AMX). Posted to the GCC mailing list today by Intel engineers are the initial patches in preparing the compiler support for ACE...

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Jim Keller Says Cerebras IPO Was Helpful As Tenstorrent Set To "Beat Them on Everything" Confirms Meeting With Intel & Qualcomm CEOs "Hoping To Get A Big Deal"

The Hot Take: Interesting, Risc-V shop from rockstar architect Jim Keller.

Jim Keller isn't bothered by Cerebras's recent IPO and says that he welcomes it, but Tenstorrent will still beat them on everything. Tenstorrent CEO, Jim Keller, Signals Deal With Intel or Qualcomm While Promising To Beat Cerebras "on everything" Tenstorrent recently introduced its latest BlackHole Galaxy server, a system with which it can disrupt the entire AI segment, with performance levels that crush the competition. We covered the announcement last month when the company demoed its Blackhole server undercutting a NVIDIA GB300 with up to five times better TCO. Keller Accepts The Challenge To Beat NVIDIA, Cerebras & Others At […]Read full article at https://wccftech.com/jim-keller-cerebras-ipo-was-helpful-tenstorrent-to-beat-them-on-everything/

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Tensordyne's 3nm Napier AI Chip Promises 13x Higher Token Throughput Than Blackwell & Blazes Past Rubin With 1000 Tokens/s In Multi-Trillion Parameter Models

The Hot Take: I really hope something comes soon to alleviate all this nonsense AI is causing.

US-based AI company, Tensordyne, has announced the successful tape-out of its Napier chip, which it claims to demolish NVIDIA's Blackwell & Rubin chips with leading token throughput and efficiency. Tensordyne’s new Napier AI Chip arrives with one clear mission: to make NVIDIA’s Blackwell and Rubin chips look considerably less impressive The Napier chip will be the core component of the Tensordyne Napier TDN system, which is designed in collaboration with Broadcom and HPE Juniper Networks. The Napier platform has one goal: to unify AI through novel logarithmic AI math, a tightly integrated memory architecture, and a high-performance scale-up interconnect that […]Read full article at https://wccftech.com/tensordyne-3nm-napier-ai-chip-13x-higher-token-throughput-blackwell-blazes-past-rubin/

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AWS Graviton5 Debuts with 192 Arm Cores and PCIe 6.0

The Hot Take: ARM seems to be breaking out from everywhere. Fujitsu, Nvidia, AWS and ARM. Qualcomm seems to be playing catch up in the server market from the looks of it.

AWS has provided a first look at its next-generation Graviton5 processor, a custom server CPU developed by Annapurna Labs for deployment across the company's cloud computing platform and AI inference infrastructure.

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Intel details long-awaited Crescent Island AI GPU at Computex, boasts up to 480 GB of LPDDR5X to combat memory shortages — company shares more details of its Xe3P inference accelerator at Computex

The Hot Take: Intel moving fast to make up lost ground on this front for sure. From the looks trying to hit the $ sweet spot too.

Intel revealed more details of its next-gen Data Center GPU, code-named Crescent Island, at Computex 2026. This inference-optimized chip will feature up to 480GB of LPDDR5X memory for efficient handling of massive AI contexts.

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Intel Resurrects On-Package Memory With Razor Lake-AX, Loading Up LPDDR6 to Hunt Down AMD’s Medusa Halo by 2028

The Hot Take: APU's competition starting to heat up for that Ai dollar.

Intel's next-generation Razor Lake-AX chips will compete directly against AMD's Medusa Halo while featuring on-package memory. Intel Is Bringing Back On-Package Memory With Its Next-Gen Razor Lake-AX Chips That Fight Against AMD's Medusa Halo On-Package Memory was last used by Intel for its Lunar Lake SoCs. These SoCs were aimed at low-power mobile platforms, and while the chips themselves offered solid performance in a 30W budget, Intel's next on-package memory solution will be a big one. As per Haze2K1 on X, Intel Razor Lake-AX SoCs will feature on-package memory. This is a big deal as moving the DRAM closer to […]Read full article at https://wccftech.com/intel-resurrects-on-package-memory-with-razor-lake-ax-to-hunt-down-amd-medusa-halo/

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