The Hot Take: USA domestic manufacturing is taking off, TSMC announcing huge expansions in Arizona. Intel getting that Federal injection is definitely keeping them alive and making them relevant again. Probably also why Nvidia dumped money into Intel too to make sure there is choice states side.
TSMC is turning into a victim of its own success as the world's preferred chip foundry, leaving its heretofore prized customers such as Apple in a bind of sorts as they suddenly find themselves crowded out by AI hyperscalers. In its frustration, Apple is now reportedly exploring the possibility of dividing up its silicon load between Samsung, Intel, and TSMC rather than remaining largely TSMC-exclusive. Apple is looking for contingencies by tentatively probing Intel and Samsung as additional vectors for manufacturing its custom chips According to Bloomberg's Mark Gurman, Apple has already held "early-stage talks" with Intel for using its […]Read full article at https://wccftech.com/apple-quietly-courts-intel-and-samsung-for-its-most-critical-chips-as-tsmcs-advanced-nodes-remain-choked-under-ai-demand/
By ckasprzak | TkOut | May 6, 2026 | Hardware, Intel
The Hot Take: Would just consider this verified he joined Intel.
Intel appoints Alex Katouzian to lead client computing and physical AI efforts and confirms Pushkar Ranade as CTO, signaling a deeper shift toward AI-driven and edge computing systems
By ckasprzak | TkOut | May 6, 2026 | Hardware, Intel
The Hot Take: Interesting, wonder is he'll be working on any RISC-V stuff for Intel.
Intel has made two big changes: the appointment of Alex Katouzian from Qualcomm in the Client Computing & AI segment, along with Purskar Randae as CTO. Alex Katouzian Appointed to Lead Intel's Client Computing & Physical AI Group Press Release: Intel Corporation today announced two key leadership appointments to strengthen its core product business and advance the company’s innovation agenda. Alex Katouzian will join Intel as executive vice president and general manager of the Client Computing and Physical AI Group. In this role, Katouzian will align Intel’s client computing business with emerging physical AI systems that span robotics, autonomous machines, […]Read full article at https://wccftech.com/intel-appoints-qualcomm-alex-katouzian-to-lead-client-computing-physical-ai-lip-bu-tan-reshapes-top-ranks/
The Hot Take: If this all is true they have a winner on their hands.
Intel's Z-Angle Memory (ZAM) is approaching completion as it races towards taking a bite at the AI boom while challenging HBM as a viable alternative. Intel's ZAM Challenges HBM As A Big Memory Innovation In the High-Bandwidth, High-Capacity Segment Offering 2x The Speed of HBM4 Z-Angle Memory or ZAM has been stirring up a lot of talk in the memory segment. The upcoming memory standard is being developed by Intel and SoftBank & aims to offer a low-power, high-density replacement to HBM. Now, new details have been shared that provide more insight into ZAM memory. For starters, the new memory […]Read full article at https://wccftech.com/intel-zam-memory-threatens-hbms-ai-throne-with-2x-the-bandwidth-of-hbm4/
The Hot Take: Just what we need Ai specific instructions for them to gobble up all the CPU's now.
APX or Advanced Performance Extensions are the next evolution of x86 as Intel & AMD co-develop new standards for the architecture. APX Expands the x86 Instruction Set, Bringing Faster Performance & New Features That Will Benefit Both Intel and AMD's Next-Gen Chips Two days ago, we talked about ACE (AI Compute Extensions), which is a unified instruction set that aims to increase matrix-multiply performance for next-gen x86 chips. ACE is just one part of the grander scheme in which both Intel and AMD are working together to evolve the x86 architecture under a single unified framework through the recently established […]Read full article at https://wccftech.com/intel-amd-work-on-apx-the-next-major-step-in-the-evolution-of-x86-architectures/
The Hot Take: Getting confusing with weather they are dropping their GPU's.
Benchmarks of Intel's upcoming and fastest gaming handheld SoC, the Arc G3 Extreme, have been leaked, surpassing the Ryzen Z2 by 25%. Intel Packs Its Strongest Battlemage GPU, & 14 CPU Cores Inside the Arc G3 Extreme Gaming Handheld SoC We recently covered Intel's first Arc G3 gaming handheld, which has been listed by online retailers. While the retailer listing was void of details for the SoC itself, we now have more specs and even benchmarks of the upcoming chip & they look phenomenal. Starting with the CPU, the Intel Arc G3 Extreme is going to be the top offering […]Read full article at https://wccftech.com/intels-arc-g3-extreme-handheld-chip-crushes-ryzen-z2-extreme-benchmark-leak/
The Hot Take: Better with less change seems to be a win!
Intel is preparing to present a refined version of its 18A process technology at the VLSI 2026 Symposium, introducing the 18A-P node as an optimized variant focused on improving power and performance characteristics without altering transistor density.
The Hot Take: If this can even compete with HBM4 then intel has a HUGE win.
Intel and SoftBank, through their joint venture Saimemory, are working on a new memory architecture aimed at addressing bandwidth limitations in AI accelerators.
The Hot Take: Intel winning all this business just means the domestic creation of products has accelerated to me. Only way they're going to get US Government Contracts or be able to sell in the US Borders. Prime example the router ban they just enacted.
Intel continues to see increased confidence for its upcoming Foundry technologies, such as 18A-P, 14A, and EMIB. Apple & Google Will Reportedly Leverage Intel Foundry 18A-P & EMIB Technologies, 14A Customers Also Lining Up. The Agentic AI and Inferencing boom has led to a significant surge in CPU demand. This has led major semiconductor companies such as TSMC to face severe supply constraints, all the while going on a large-scale expansion spree to meet demand. At the same time, Intel has been driving revenue up by selling off salvaged dies, but the company is also attracting the attention of various […]Read full article at https://wccftech.com/intel-18a-p-pulls-in-apple-next-m-chips-emib-reportedly-wins-google-tpuv8e/
The Hot Take: Will be interesting to see where this goes. I'm wondering what type of cooling/heating this will bring using this medium over what it's replacing.
Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years. Intel-Partner, Amkor, Says Glass Substrates Will See First Commercialization Within Three Years Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet growing compute and memory demands. TSMC is the single-most important advanced packaging provider in the world thanks to its CoWoS 2.5D technology. Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased […]Read full article at https://wccftech.com/intel-backed-glass-substrates-tech-will-be-commercilization-ready-within-three-years/