The Hot Take: Yes! No new case possibly.
The company confirmed it in an unusual way, but it seems legit, and as per the announcement, the coolers should arrive soon. Noctua Announces NL-LC1 Chromax.Black AIO Series Despite Exclusion From the Roadmap; The New Variant is Expected to Arrive This Year The Noctua's latest and first-ever AIO cooler series was dropped two weeks ago. The NL-LC1 is what Noctua aims for, superior cooling, which is available in various form factors. Whether you want to cool a mid-range or a high-end CPU, it offers the AIO in various sizes, including 240mm, 360mm, and 420mm for enthusiast-grade PCs. Built using the […]Read full article at https://wccftech.com/noctua-confirms-nl-lc1-chromax-black-aio-series/
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The Hot Take: Motherboard bending = BAD.
Intel appears to be cooking up a beefier Nova Lake socket clamp to stop its future desktop chips getting bendy or crispy.
If you are a hardware enthusiast, you probably know Intel’s independent loading mechanism, or ILM, can warp CPUs over time. The ILM is the retention clamp that holds the CPU in the socket, which sounds dull until your chip starts looking like a Pringle.
According to Hot Hardware Chipzilla released a reduced-load version of the ILM with Arrow Lake, which mostly fixed the issue, but made it optional. Now Chipzilla appears to have another ILM variant coming with Nova Lake. This one looks less about correcting curvature and more about dealing with high current.
Older processors used pin grid array sockets, or PGA, where the pins sat on the CPU itself. Modern chips use land grid array sockets, or LGA, where the pins live in the socket instead.
LGA has plenty of advantages, including denser pins, better electrical performance and CPUs that are less likely to be mangled by ham-fisted builders. The downside is that it needs a precise compression force to ensure the CPU and socket contact each other properly.
That is why Intel uses ILMs, while…
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The Hot Take: Interesting to see more try do create pump-less All-in-One H2O setups.
ENERMAX has introduced a new lineup of cooling products designed for the increasing thermal demands of AI systems, workstation platforms, and future high-performance desktop hardware.
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The Hot Take: Yeah looks like that CZ market is going to get a new avenue of revenue soon enough. Hoping the prices can be kept down is my only concern.
MSI has shown off new cooling and power tricks for future Nvidia RTX graphics cards.
The outfit has said that since the company is not expecting a major gamer GPU launch this year, it used the gap to show what might land on future Nvidia RTX cards and what it will have to come up with to match.
MSI said that it is working on three main areas for its next designs: cooling, power delivery and the PCB. The cooling work includes new fans, heat pipes, thermal pads and baseplates, all dressed up as an advanced thermal architecture. The fan design uses ultra-thin metal blades rather than the usual plastic jobs.
MSI says the seven-blade all-metal design can deliver up to 40 per cent better airflow. The trick is a high-rigidity metal structure packed into a 0.8mm blade, which should resist deformation at higher speeds.
Thinner blades give more effective airflow area, while wider paths reduce resistance during high-speed operation.
MSI is also working on advanced spiral-groove heat pipes. These increase contact area compared with conventional heat pipes, which should help shift heat away from the GPU more efficiently.
The company has added diamond-composite thermal pads for memory modules to improve heat dissipation. There is also a diamond-copper composite baseplate, with a diamond-copper layer stacked between two copper layers.
MSI says this creates a high-conductivity path from the GPU to the heatsink. All these parts come together in a fully integrated cooling module.
One early design was shown as a next-generation Gaming Trio graphics card. MSI displayed it on an existing RTX 5090 32GB GPU, although it remains a prototype rather than a finished retail card.
The final version is expected to arrive with future Nvidia GPUs, so for now, it is more engineering peep show than shopping list.
MSI is bringing its Safeguard technology directly to high-end graphics cards. The feature first appeared on the company’s MPG power supply line.
The same protection and control, handled through software and hardware, will now work from the 16-pin connector on the graphics card. That means users will not need a compatible PSU to get the feature working.
MSI is still validating the technology with more power supplies and is expected to give it a new name. The company is also adding server-grade reusable fuses, called eFuse, to future GPUs. These are designed to protect the card from electrical damage using an internal gate-based reset mechanism.
The company says the fuses are resettable and reusable, with a short-circuit response of about 200ns. That should help long-term reliability, although anyone who has watched 16-pin connector drama will know reassurance is doing plenty of work here.
MSI showed the design on its RTX 5090 SUPRIM Safeguard card. As with the cooling module, these technologies are intended for future graphics cards rather than the shelves today.
It all points to GPU makers preparing for more power, more heat and more expensive lumps of hardware that need not cook themselves while running the next AI-slathered benchmark.
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The Hot Take: As GPU's and CPU's get hotter and hotter only going to become more of the norm, unless they don't get ride of DYI building and maybe allow us to buy GPU's like CPU's w/out cooling solutions.
A user on Reddit is claiming a massive 20°C temperature drop on an ASUS TUF Gaming GeForce RTX 4080 graphics card simply by removing the stock thermal compound it shipped with and replacing it with a phase change thermal pad based on Honeywell's PTM7950, a proprietary material that gained some notoriety a couple of years ago.
Part of what
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The Hot Take: With how hot these chips are was only time before they worked with Asetek. Still waiting on the thermo-siphon cooler they've been showing at trade shows. I want that 0 pump sound.
Noctua has confirmed that its long-awaited all-in-one liquid cooler, developed in partnership with Asetek, is almost ready for launch and should be coming in Q2 2026. The cooler has passed Production Validation Testing, meaning it has met both performance and manufacturing targets and is heading into full production.
According to Asetek’s announcement, caught by Overclock3d.net, the Austrian-based cooling company is not just going to use its own fans onto an off-the-shelf design, and while the unit is based on Asetek’s G8 V2 platform, Noctua is adding its own twist, including a triple-layer noise dampening setup designed to tame pump noise and vibrations, along with multiple performance profiles so users can tweak the balance between cooling and acoustics.
It is also pairing the cooler with its next-generation NF-A12x25 G2 and NF-A14x25 G2 fans, alongside a redesigned radiator using specially designed fins to improve airflow efficiency and keep noise levels down at lower speeds.
Of course, Noctua is bringing its SecuFirm2+ mounting system along for the ride, with support for both AMD and Intel platforms and some offset mounting tricks to better target modern CPU hotspots. The new AIO cooler is expected to come in 240mm, 360mm, and 420mm versions, and while pricing is still under wraps, this one is clearly aimed at the high-end market.
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The Hot Take: With GPUs and CPUs getting smaller and hotter need better transmission of heat.
A thermal pad with a vapor chamber on top might be the TIM your next phone's SoC will use. Xerendipity's new products are meant to keep your phone cooler without sacrificing thickness or cost.
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