255 posts
The Hot Take: Excellent news for them!
Intel is reportedly making a significant change to the manufacturing strategy for its upcoming Nova Lake processor family by shifting the majority of compute tile production back to Intel Foundry.
Read the full articleThe Hot Take: Makes sense, especially if China takes Taiwan....
According to the Wall Street Journal (paywalled), Apple agreed to use Intel's U.S. chipmaking plants after White House officials pressured Tim Cook during tariff-relief talks last summer. MacRumors reports: In August 2025, Apple CEO Tim Cook was in Washington to lobby the Trump administration to drop its proposed 100 percent tariff on semiconductor imports -- a levy that would have raised costs across Apple's product line. Apple reportedly secured an exemption after pledging to invest hundreds of billions of dollars in the U.S., although many of those investments were already planned. During the meetings, president Trump and commerce secretary Howard Lutnick are said to have urged Cook to use Intel's fabrication plants to make some of Apple's chips. The link between the tariff talks and the Apple-Intel deal had not been previously reported. Almost a year later, Trump announced via his Truth Social platform that Apple would begin using Intel-made chips in some products. "We need to design and build our Chips right here in America," the president posted. The news sent Intel shares to record highs. According to a person familiar with the negotiations cited by the WSJ, Apple plans to have Intel make chips for both Mac laptops and iPhones. The report doesn't say which chips or in what volume, and Apple is expected to remain reliant on Taiwan Semiconductor Manufacturing Company, or TSMC, for the majority of its custom silicon. Read more of this story at Slashdot.
Read the full articleThe Hot Take: I'm hoping this gets resolved soon. Appears to be hinged on the Ai bubble bursting and I'm hoping that's soon.
PC shipments are falling, but revenue for manufacturers is still rising.
Read the full articleThe Hot Take: We'll have to see, they just keep milking Ai at the cost of liquidating a whole other industry.
The GeForce RTX 50-series desktop graphics lineup has remained unchanged for just over a year now (since the introduction of the RTX 5050), and none of the conversations we've had at major trade shows suggests that a mid-cycle Super refresh will occur any time soon. But there are still signs that such an update could still happen at some point, and the latest sign comes from Seasonic, which has listed an RTX 5080 Super, an RTX 5070 Ti Super, and RTX 5070 Ti Super in its PSU wattage calculator. Go deeper with TH Premium: GPUs(Image credit: Noctua)Desktop RoadmapEnterprise RoadmapRubin in-depthThe Stout Owl: The ultimate Noctua G2 PCYou can click through the calculator and assemble a hypothetical system with these unannounced products inside. To be useful, this calculator also provides board power numbers for these as-yet-unreleased cards, and that gives us another bit of juicy info. Given that no official specifications for these GPUs exist, it's impossible to say whether these figures are accurate. But it does allow us to speculate a bit on how they might stack up to existing products. Unannounced RTX 50 Super-series TGPsGraphics CardTotal Graphics Power (W)% ChangeRTX 5070250--RTX 5070 Super275*10% RTX 5070 Ti300--RTX 5070 Ti Super350*17%RTX 5080380--RTX 5080 Super415*15% *As listed in Seasonic PSU calculator. Unconfirmed by Nvidia. Seasonic gives this purported RTX 5080 Super a board power of 415W in its calculator, or 15% higher than the existing RTX 5080's 360W envelope. That makes sense, because the RTX 5080's GB203 GPU is already fully enabled, so any Super version of that card would have to lean on higher power limits and more aggressive clock speeds to see any baseline performance benefit. That figure could also partially account for slightly higher power usage from 8 GB more GDDR7 memory on such a card. Past RTX 50 Super-series rumors have suggested that Nvidia will boost VRAM capacity on those products by moving to higher-density GDDR7 modules with 3GB of capacity each. GDDR7's power consumption as part of the overall board picture is relatively small, but more of it will still matter. If Seasonic's figures are accurate, we should also expect a similarly sized TGP increase out of the RTX 5070 Ti Super, whose 350W rating is 17% higher than that of the RTX 5070 Ti. The RTX 5070 Super, meanwhile, gets only a 10% TGP bump over the RTX 5070, from 250W to 275W. Both of these cards rely on GPUs that are slightly cut down from their full available resources, so it's possible that Nvidia could boost their performance through a balance of enabling more Streaming Multiprocessors (SMs) in addition to boosting clocks through higher power envelopes. Beware of extrapolating performance improvements directly from these percentages, though. Our own testing has shown that any real-world performance benefits from these power limit increases are likely to be smaller than those figures would suggest. As our review of the MSI RTX 5090 Lightning Z showed, the largest performance boosts from higher power limits are likely to be concentrated in ray-traced and path-traced games, whose computational intensity is significantly higher than pure raster titles and is more likely to run the GPU into its power limits. In any event, we shouldn't expect to see these products any time soon. Nvidia has instead been focused on getting more out of existing Blackwell silicon with software improvements such as DLSS 4.5 upscaling and Multi-Frame Generation multipliers up to 6X. These technologies enable higher output frame rates and image quality with lower input resolution than past DLSS technologies, and the boost to both performance and image quality from those technologies in tandem has certainly made existing Blackwell products more appealing than they were at launch.But as monitor refresh rates continue to climb thanks to ongoing improvements to OLED and LCD panels, and next-generation HDMI 2.2 connectors looming over 2027, a hardware update of some kind that boosts baseline performance and potentially implements support for those standards seems practical at some point. Given these primarily consumer-focused improvements, an announcement at CES 2027 or Computex 2027 might make sense. As with any future product rumors, however, only time will truly tell.
Read the full articleThe Hot Take: Was almost like they were purposefully crippling their processors under past management.
Intel Nova Lake CPUs will mark the return of AVX-512, a feature that has long been abandoned by the company for its client CPUs. AVX-512 Is Coming Back To Intel's Consumer CPUs, Starting With Nova Lake Intel has had a love-hate relationship with AVX-512 on its consumer CPUs. The AVX-512 instruction set was last seen on Intel's Tiger Lake (11th Gen) family, and since then, the company has offered no support for it on its modern-day chips. Meanwhile, AMD has been offering AVX-512 support on its Zen 4 and Zen 5 chips, both client and server platforms. Last year, we […]Read full article at https://wccftech.com/intel-nova-lake-cpus-to-bring-back-avx-512-support-six-years-after-it-was-abandoned/
Read the full articleThe Hot Take: Competition is GOOD.
Intel has published a new patent on its XBM memory, which is proposed as a replacement for HBM4, offering much higher bandwidth capabilities. XBM vs HBM: Intel's New Proposed DRAM Solution Extends To 32 GT/s Speeds, While Reducing Costs Through UCIe Links HBM continues to be the standard for AI accelerators, but more recently, we have seen LPDDR memory being used to overcome shortages, prices, and power associated with the standard. Intel's past attempts at DRAM, such as HMC (Hybrid Memory Cube) and MCDRAM, faced various issues and never came to market, but with XBM, Intel is course-correcting its DRAM […]Read full article at https://wccftech.com/intel-xbm-memory-takes-aim-at-hbm4-32-gt-s-speeds-lower-costs-through-ucie-links/
Read the full articleThe Hot Take: New Micro-FAB? Jim Keller involvement, interesting.
Atomic Semi, the semiconductor tooling startup founded by chip architect Jim Keller and DIY fabrication pioneer Sam Zeloof, has rebranded as Fab2 and moved its operations to Texas, according to the company's new site at fab2.com. The rebrand recasts the company around the idea they're calling a "fab fab," a factory that mass-produces small semiconductor fabs and the tools inside them.Fab2 designs and builds every tool in its fabs in-house, from pumps, valves, and gas lines to lithography and the vacuum chambers that house it. The company assembles those components into machines, the machines into complete fabs, and then aims to mass-produce the fabs themselves. It pairs the hardware with Studio, an in-browser, collaborative EDA tool for layout, schematic, and simulation work, previously branded as Atomic Studio.Rather than moving 300mm wafers through ginormous production lines, Fab2 targets small, software-defined fabs that pattern chips far smaller than a wafer and turn prototypes around in hours. Zeloof built the concept's proof point as a teenager, fabricating lithographic chips in his parents' garage down to roughly 300nm features before co-founding this company with Keller in 2022.The method's main constraint, however, is throughput. Electron-beam lithography writes patterns directly rather than projecting them through a mask, which makes it slow: a single patterning step on a small chip can take far longer than an EUV scanner needs to expose an entire 300mm wafer. That's a big tradeoff that only really suits prototyping and low-volume runs rather than high-volume production at commercial foundries.Fab2 now operates three sites: a 120,000 square foot facility in Austin serves as the new headquarters for research and production, a 30,000 square foot site in Lockhart houses the "fab fab" itself, and the original 25,000 square foot "garage fab" remains in San Francisco. Fab2 said it shifted its hiring focus to Texas after four years in California, and Tracxn lists the company at around 84 employees as of May 2026. The startup raised a reported $15 million seed round in 2023, led by the OpenAI Startup Fund, at a valuation of about $100 million, with angel backing from Naval Ravikant, Nat Friedman, and Fred Ehrsam.In moving to Texas, Fab2's model of many small, printable fabs now sits beside the likes of Tesla and SpaceX, which announced Terafab back in March, a single Austin megafab targeting a terawatt of annual compute at a cost of up to $119 billion. The contrasting businesses are clearly not competitors; Fab2 sells small fabs and prototyping speed, while Terafab is built for high-volume AI. But they represent competing answers to the same question of how the U.S. should expand its chipmaking capacity — consolidate everything in massive manufacturing campuses, or distribute production across many small, replicable fabs?
Read the full articleThe Hot Take: Yes! No new case possibly.
The company confirmed it in an unusual way, but it seems legit, and as per the announcement, the coolers should arrive soon. Noctua Announces NL-LC1 Chromax.Black AIO Series Despite Exclusion From the Roadmap; The New Variant is Expected to Arrive This Year The Noctua's latest and first-ever AIO cooler series was dropped two weeks ago. The NL-LC1 is what Noctua aims for, superior cooling, which is available in various form factors. Whether you want to cool a mid-range or a high-end CPU, it offers the AIO in various sizes, including 240mm, 360mm, and 420mm for enthusiast-grade PCs. Built using the […]Read full article at https://wccftech.com/noctua-confirms-nl-lc1-chromax-black-aio-series/
Read the full articleThe Hot Take: I really wonder if this will deflate the Ai bubble even a little bit.
The x86 Ecosystem Advisory Group led by Intel and AMD recently firmed up the AI Compute Extensions (ACE) specification for optimizing x86 for AI computation tasks around matrix multiplication and the like for machine learning workloads. The cross-vendor ACE extension is ultimately a successor to Intel's Advanced Matrix Extensions (AMX). Posted to the GCC mailing list today by Intel engineers are the initial patches in preparing the compiler support for ACE...
Read the full articleThe Hot Take: Intel Ramping things up to play catch up and win volume from TSMC.
Intel this week initiated expansion of its Bowers Campus in Santa Clara, California, in a bid to produce more photomasks (reticles) in the U.S. The company intends to build a new manufacturing facility and a new utility building at the site, which will reinforce the site's position as a key producer of photomasks for Intel.Go deeper with TH Premium: Chipmaking(Image credit: tsmc)A deeper look at the chipmaking supply chainTSMC's $165 billion U.S. investments examinedChina reportedly reverse-engineers EUV toolChina bets on DUV, as EUV blockade reshapes chipmakingEarlier this year Intel obtained approval to build a new 107,000 square feet (9,940 square meters) manufacturing facility with Class 1 cleanroom at its Bowers Campus, and this week it formally began construction on the expansion, which it kicked off at a ceremony attended by its top executives and Santa Clara mayor Lisa Gilmor. The new facility will be able to write 6-inch × 6-inch photomasks both for DUV and EUV layers and a variety of nodes (from 32nm down 1.4nm-class), though the primary focus of the facility is to produce reticles for leading-edge process technologies — such as Intel's 18A, 18A-P, 14A, and more advanced — that rely on advanced DUV, EUV and eventually High-NA EUV tools and require more advanced photomasks, such as those that feature extremely dense patterns and use curvilinear optical proximity correction (OPC) with curved geometric shape.(Image credit: Intel)Intel is one of a few leading chipmakers in the world that still maintains a world-class mask writing shop — which is important, as every advanced product requires hundreds of masks, and every mask revision directly affects production schedules. In addition, producing masks in-house is getting particularly important when it comes to reticles for EUV layers as EUV tools tend to damage masks over time (despite usage of protective pellicles), so having the ability to make new masks in a short amount of time is crucial. Furthermore, Intel is the only semiconductor producer to make its own tools for photomasks writing at its IMS Nanofabrication subsidiary. Historically, reticles were patterned using a single e-beam tool, which was slow. By contrast, IMS produces multi-beam mask writers (MBMWs) that project 262,144 independently programmable electron beams simultaneously, which increases throughput by orders of magnitude at a nanometer-scale placement accuracy.(Image credit: Intel)"Santa Clara has been home to some of Intel's most important manufacturing innovations for decades," said Dr. Frank Abboud, VP Intel Foundry & GM of Intel Mask Operations. "By expanding the Bowers campus mask operations, we're strengthening a critical capability that supports advanced process technology production around the world and reinforces Intel Foundry's commitment to advancing U.S. semiconductor manufacturing leadership."Intel's Bowers Campus in Santa Clara has been dedicated to mask production since 1986. The site forms the company's primary mask manufacturing infrastructure supporting together with the company's facility in Hillsboro, Oregon. Production of non-critical masks has historically been outsourced, though we do not know whether the company still does that.IntelIntel
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