The Hot Take: AMD getting ready for Intel refocus on HPDT?
With Threadripper, it has always been a bit like heavy-haul transport on the motorway: massively overdimensioned for normal users, but for certain workloads exactly the kind of tool where every additional lane matters. Now AMD’s next workstation generation has become tangible for the first time. An entry for “TR6 Mustang Peak” has appeared in AMD’s […]
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The Hot Take: This is an interesting collaboration between the two seeing intel keeps saying they're not going to stop GPU development.
Intel's Serpent Lake SoCs featuring NVIDIA's RTX GPU tiles as integrated graphics are expected to roll out by Q1 2028. Intel & NVIDIA's Co-Developed Serpent Lake SoCs Featuring Next-Gen CPU & GPU Architectures Rumored For Q1 2028 Last year, Intel announced that it was working with NVIDIA on a custom SoC that would incorporate NVIDIA's RTX GPU tiles. Intel stated that these SoCs will power a wide range of PCs that require the integration of these levels of CPUs & GPUs together into a single package. It looks like we have our first timeline of when these SoCs will be […]Read full article at https://wccftech.com/intel-serpent-lake-socs-with-nvidia-rtx-gpu-tiles-reportedly-arrive-in-q1-2028/
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The Hot Take: Question is, do I go HPDT with Z990 or Consumer Z970? I guess I'll have to see the benches on if HPDT does anything for Gaming.
The Z990 PCH for Nova Lake motherboards is apparently 22% smaller than Z890, despite featuring a higher power maximum power draw of up to 14W. The leaked picture of the PCH shows a 11.15 x 6.5mm die and 25 x 24mm package, but we're unsure what motherboard it actually comes from.
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The Hot Take: CISC muscle on display... When you don't care about how many watts your cpu consumes ARM/RISC will never touch the raw throughput of these chips.
AMD has shared the first official results for its 256-core EPYC Venice CPU, saying it beats Nvidia's Vera by 3.3x in a rack-level deployment.
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The Hot Take: Motherboard bending = BAD.
Intel appears to be cooking up a beefier Nova Lake socket clamp to stop its future desktop chips getting bendy or crispy.
If you are a hardware enthusiast, you probably know Intel’s independent loading mechanism, or ILM, can warp CPUs over time. The ILM is the retention clamp that holds the CPU in the socket, which sounds dull until your chip starts looking like a Pringle.
According to Hot Hardware Chipzilla released a reduced-load version of the ILM with Arrow Lake, which mostly fixed the issue, but made it optional. Now Chipzilla appears to have another ILM variant coming with Nova Lake. This one looks less about correcting curvature and more about dealing with high current.
Older processors used pin grid array sockets, or PGA, where the pins sat on the CPU itself. Modern chips use land grid array sockets, or LGA, where the pins live in the socket instead.
LGA has plenty of advantages, including denser pins, better electrical performance and CPUs that are less likely to be mangled by ham-fisted builders. The downside is that it needs a precise compression force to ensure the CPU and socket contact each other properly.
That is why Intel uses ILMs, while…
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The Hot Take: Creeps back into the chips...
AMD’s Zen 5 looked efficient, but weak demand and a dodgy RDSEED bug have taken the shine off.
For those with long memories, AMD’s Ryzen 9000 series arrived in 2024, promising strong efficiency and decent IPC gains. Months later, the launch looks messier. Sales were soft, prices fell quickly, and a documented random-number flaw has spooked some buyers.
The line-up included the 16-core Ryzen 9 9950X, 12-core 9900X, eight-core 9700X and six-core 9600X. Early benchmarks were mixed. Gaming gains were often single-digit at higher resolutions, while productivity wins varied by workload.
Reviewers liked the cooler running and lower power use, but Zen 4 owners saw little reason to upgrade. AMD leaned harder into X3D chips, where stacked cache delivered clearer frame-rate gains for gamers.
According to Webpro News in late 2025, AMD detailed an RDSEED flaw affecting all Zen 5 processors. The bug, tracked as AMD-SB-7055 and CVE-2025-62626, hits the 16-bit and 32-bit versions of RDSEED.
They can return zero far more often than proper randomness allows, while the carry flag still reports success. That means software trusting the hardware output can swallow predictable data, which is grim news for cryptography.
Linux patches moved to disable the affected instruction or use other sources, but AMD has not issued a recall and points to microcode and software mitigations.
By early 2026, AMD was preparing refreshed SKUs to counter Intel’s Arrow Lake updates. Leaks pointed to Ryzen 7 9750X and Ryzen 5 9650X models with higher TDPs, higher clocks and improved memory support in some setups.
That looks like squeezing more speed from existing silicon. Power rises and Zen 5’s efficiency pitch gets thinner. Corporate buyers have reason to wait until mitigations are stable. Gamers are likely to favour X3D models, which offer clearer frame-rate gains and less early-launch baggage.
Server and workstation buyers have more to worry about because secure boot, VPNs and database encryption depend on reliable entropy.
Zen 5 still brought gains in branch prediction, cache design and TSMC N4P fabrication. The RDSEED bug does not erase that work, but it exposes an awkward validation gap.
AMD keeps shipping Zen 5 parts, and AM5 support remains a useful strength. Still, modest adoption, a documented RNG flaw and fast refresh plans make Zen 5 look less tidy than AMD wanted.
System builders running cryptographic workloads should avoid first-wave Zen 5 chips unless mitigations are tested. Everyone else should look harder at refreshed SKUs or X3D parts while AMD patches the trust problem.
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The Hot Take: Interested to see if they catch up on the new platform.
Intel and its partners have prepared for the Nova Lake launch, and even though we are months away, we might witness more leaks like these. Intel Socket LGA 1954 Spotted in Taipei, Intel's Platform for the Next-Gen Nova Lake-S Processors With Dual Retention Design The LGA 1954 socket appeared out of nowhere in Taipei, and it's probably the first time we've seen a real one. The user @laurentschoice posted a pic of an LGA 1954 socket, mentioning that it was spotted in Taipei. It might be one of the early samples, prepared by some motherboard vendor, but it's not clear […]Read full article at https://wccftech.com/intel-next-gen-lga-1954-socket-for-nova-lake-makes-online-appearance-for-the-first-time/
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The Hot Take: Following AMD with releasing DDR4 chips again? We'll have to wait and see. This RAM crunch is getting horrible for sure.
Intel sat down with Tom's Hardware at Computex 2026, and the company says it recognizes the importance of Raptor Lake and DDR4 platforms as the memory crunch continues.
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The Hot Take: New P-Cores and bus, sounds like Intel is trying to innovate again. Which is good for all of us, healthy competition will help bring/keep prices down for CPUs at least.
Intel has officially confirmed its next-gen Xeon 7 Diamond Rapids CPUs are coming in 2027, featuring 50% higher core counts and twice the memory bandwidth of Xeon 6 in a bid to compete against AMD’s upcoming EPYC Venice CPUs.
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The Hot Take: Well have to see if this claim holds up on launch.
Intel is putting its 18A node into the data center with new Xeon 6+ Clearwater Forest CPUs, which pack up to 288 E-cores for dense compute.
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