Intel CEO Lip-Bu Tan has acknowledged that the semiconductor giant must catch up to rivals AMD and Arm, and said it now assumes edge AI and robotics will be a business as big as PCs. Tan made those remarks during Intel’s Q2 earnings call, which saw the company report $16.1 billion revenue – a 25 percent year-on-year increase. “Q2 was another quarter of solid execution,” the CEO said. “Revenue, gross margin, and earnings per share were above our guidance. This marks the seventh consecutive quarter of exceeding our financial expectations.” Yet it didn’t deliver a profit as Intel reported a GAAP loss of $11 billion (and a non-GAAP loss of $2.2 billion). Tan remained optimistic about Intel’s prospects, thanks to the AI boom spurring demand for many of its products, and its foundry service. “Our core server CPU franchise is growing faster than ever,” the CEO said, before observing the Xeon 6 range “continues to be one of the fastest-ramping products in Intel's history.” That may be the case, but Intel’s hyperscale customers have designed their own Arm-powered CPUs and are deploying so many that analyst firm IDC recently found non-x86 servers now account for almost half of all sales. Intel’s great rival, AMD, has grown its market share to a third of the x86 server market. During the earnings call, Morgan Stanley analyst Joe Moore asked Tan how he plans to regain market share. Tan pointed to Intel’s forthcoming Clearwater Forest, Diamond Rapids, and Coral Rapids processors as evidence the company is creating products that can compete with anyone. “Some areas we are still behind,” he admitted, “but we are catching up very fast and we try to leapfrog some of the CPU architecture, and we are putting major effort into it. Time will tell.” Tan is also pondering time in terms of how component shortages impact the company’s sales and revenue. “The industry is facing one of the most severe supply constraints in its history, across leading-edge logic silicon wafers, memory, and substrates,” he said. “These shortages will persist for the foreseeable future.” Intel is of course a big player in the semiconductor supply chain, and Tan offered the happy news that wafer output across its major manufacturing nodes exceeded expectations from 90 days ago, and that yields from its leading-edge 18A process “are trending ahead of targets.” The CEO also said, “supply remains very tight and the near-term linearity of our supply growth is more skewed towards the end of Q3 and into Q4, especially for servers.” He had slightly better news about Intel’s foundry business, which is developing an advanced manufacturing process called 14A that could make Chipzilla a more formidable competitor to TSMC. “We remain on track for 14A risk production for our internal products in the second half of 2027, and we made the decision in Q2 to fully commit to high volume ramp in 2028,” Tan said. Intel’s current flagship 18A process is also going well. “In our core PC client segment, Intel 18A is now in volume production across multiple commercial and consumer products,” Tan said. “Our factory output continues to increase sequentially every month. The successful high volume ramp of 18A for our internal products provides important validations as Intel Foundry engages with external customers.” The CEO added his view that “We still have work to do to establish a strong footprint in the edge and physical AI ecosystem but see this opportunity as an important future growth driver.” So important that Intel recently renamed its PC business the “Client Computing and Physical AI Group” (CCPG). That change is more than cosmetic, because CFO David Zinsner said Intel believes “the edge and physical AI opportunity is likely to at least match the client TAM [total addressable market] over time.” That would make edge and physical AI an $8 billion business, given that in this quarter Intel said ten percent of CCPG’s $8.9 billion revenue came from edge products. Overall CCPG revenue rose 13 percent year-over-year, growth that Intel found pleasantly surprising. Zinsner said the PC market is “softer” in part due to “the memory dynamics in the marketplace,” and predicted Q3 performance will fall. ®
The Hot Take: USA domestic manufacturing is blowing up and saving Intel.
Intel Foundry might be heading into a big deal with NVIDIA, as the company is expected to offer packaging and wafer support for next-gen Feynman GPUs. NVIDIA Feynman GPUs Could Be Intel Foundry's Biggest Win To Date With Chipzilla Providing Both Packaging & Wafer Supply A deal between Intel and NVIDIA won't be a major surprise for those following our previous reports, but it is definitely a big win for Intel's Foundry business. Earlier this year, we reported that NVIDIA might be looking into Intel's upcoming process & advanced packaging technologies for its next-generation GPUs, codenamed Feynman. Well, according to […]Read full article at https://wccftech.com/intel-foundry-nvidia-feynman-gpu-wafer-packaging-deal/
Intel and AMD are signing long term agreements with Chinese data center firms to provide them with CPUs for AI computing, says a report from Reuters. CPUs in AI computing rose to prominence earlier this year after agentic AI demand reshaped the market. Agentic computing places a greater emphasis on CPUs, and according to the sources, the deals are motivated by the rapid price rise due to high demand. AMD & Intel Set To Cover A Year's Worth Of CPU Supplies To Chinese AI Data Centers, Says Report The surge in AI demand for CPUs has also led to Intel […]Read full article at https://wccftech.com/intel-and-amd-lock-in-year-long-cpu-deals-with-chinese-ai-firms-as-prices-surge-40/
The Hot Take: Will have to take this with a bit rock of salt until we see the benches and real world performance. Just a price grab or actual performance?
AMD is apparently no longer satisfied with being perceived as a perennial underdog, and is reportedly choosing to make a bold statement by pricing its Helios rackscale solution at a hefty premium to NVIDIA's Rubin. What's more, AMD has reportedly managed to rope in Microsoft as the product's first confirmed client, demonstrating the utility that Helios offers even at its supposedly elevated price point. Futurum believes AMD will price Helios at $5 million to $5.5 million per rack, versus an expected retail price of $3.5 million to $4 million for the second-gen NVIDIA Rubin rack As we explained in a […]Read full article at https://wccftech.com/amd-is-reportedly-pricing-its-helios-rack-40-above-nvidias-second-gen-rubin-confident-that-customers-will-pay-the-premium/
The Hot Take: The more the merrier and helps Intel get back to track making and developing x86 CPUs. Hopefully GPUs too.
Fortinet on Tuesday revealed it will use Intel Foundry to fab its sixth-gen Security Processor (SP6), a nice win for Chipzilla's sputtering chipmaking biz. The chips feature dedicated accelerators designed specifically for the security and cryptographic operations required by modern hardware firewalls. The custom chips are one of Fortinet's defining features. Many cybersecurity hardware players build appliances around commodity hardware like x86 and Arm CPUs, but Fortinet prefers custom application-specific integrated circuits (ASICs). The two companies haven't said when the chips will enter production, much less what the SP6's speeds and feeds will entail, though we imagine it'll have a bit more pep than Fortinet's SP5 chips. The SP5 launched in 2023 and boasted support for layer 7 firewalling and IPsec VPN connectivity at speeds exceeding 30 Gbps. Throughput fell when advanced threat protection or SSL inspection was enabled, but Fortinet still claimed a speedy 4.3 Gbps and 3.3 Gbps, respectively. As you might have already figured out, Fortinet's SP line is designed primarily for smaller appliances like SD-WAN gateways, rather than larger datacenter-centric appliances built around its beefier NP and CP-series parts. While Intel couldn't offer much detail on the chip itself, we're told it will use the older Intel 4 process node rather than the leading-edge 18A process tech. Chipzilla also suggested Fortinet will draw on its experience in disaggregated semiconductor design and advanced packaging, which could mean a chiplet architecture with greater scalability. With so little detail, we can only speculate. Intel declined to say which technologies beyond Intel 4 the chip will use. The x86 giant also declined to comment on the availability of the product, noting only that "details regarding the Fortinet Security Processor 6 availability will be announced at a later date." While SP6 won't use the latest chipmaking tech, it will be built in an American fab by an American company, offering a level of supply chain security that remains difficult to find. If you want even remotely leading-edge silicon, Intel, Samsung, and TSMC are your only options. US-based production can still mean settling for a less advanced process, although TSMC's first Arizona fab has already begun churning out 4 nm silicon and Samsung aims to bring its new Texas plant online this year. Fortinet would not be the first to enlist Intel's manufacturing might for sensitive workloads. Under DARPA's HIVE program, the chipmaker built an eight-core, 528-thread processor with 1 TB/s silicon-photonics interconnects specifically to accelerate graph analytics workloads. But it doesn't stop at the DoD. Supply chain security is something Intel has leaned into as it has sought to reinvent itself from an integrated device manufacturer serving mainly itself, and occasionally the US government, into a full-fledged foundry ready to compete with Samsung and, ultimately, TSMC. In mid-2024, Uncle Sam awarded Intel $3 billion to establish a secure enclave for manufacturing chips for government agencies. Since then, the US government has taken a 9.9 percent stake in the American chip biz. ®
The Hot Take: Bitch and moan, better than paying the tariffs sir.
TSMC's CFO Wendell Huang shared last week that the firm is seeing strong demand from US customers. The executive's comments came after the Taiwanese firm's latest earnings report, which also saw it announce an additional $100 billion investment in the US. Huang outlined that TSMC's 3-nanometer facilities in the US should come online by the second half of next year and added that the costs of building facilities in the US were higher than in Taiwan. TSMC CFO Says US Fabs Cost Four To Five Times More To Build Than In Taiwan TSMC's latest $100 billion announcement will expand the […]Read full article at https://wccftech.com/tsmcs-cfo-admits-us-fabs-cost-four-to-five-times-more-than-taiwan-yet-doubles-down-with-100b-bet/
The decision to employ older Cortex-X925 and Cortex-A725 cores on the RTX Spark to form a 20-core CPU configuration will probably haunt NVIDIA because a new Cinebench 2026 leak reveals that the chipset produces subpar multi-core results, despite Microsoft’s Surface Laptop Ultra housing the SoC set to the ‘High Performance’ profile. Fortunately, the RTX Spark manages to retain some dignity in the single-core benchmark. High Performance mode on Surface Laptop Ultra isn’t enabled by default, but hidden configuration allows RTX Spark’s Cortex cores to pull nearly 50W in new test We’ve previously reported that the altered Cortex-X925 cores running RTX Spark were […]Read full article at https://wccftech.com/rtx-spark-cinebench-2026-disappointing-multi-core-results/
The Hot Take: Long wait for the next build I guess.... LOVIN' the Antec Flux Nocua edition until then I guess.
Intel was expected to unveil its next-generation desktop processors later this year. The upcoming Nova Lake lineup has been making the rounds online, and a new report from VideoCardz suggests that Intel could introduce it under the Core Ultra Series 400 branding. For context, the current Arrow Lake and Arrow Lake Refresh desktop CPUs follow the Core Ultra Series 200 naming scheme, while Intel's latest Panther Lake mobile processors carry the Core Ultra Series 300 branding.Go deeper with TH Premium: CPU(Image credit: Tom's Hardware)CPU scaling with DLSSRyzen to the top: How AMD innovated in the gaming CPU marketHow ARM is working its way into PCsAMD CES 2026 gaming trends press Q&A roundtable transcriptThe report also claims to reveal the review embargo windows and launch timeline for several Nova Lake models. According to the report, Intel will initially introduce a 28-core DS package, which is expected to launch between January and March 2027. The new DS suffix is said to be an internal package designation for processors featuring dual-compute tiles. This will reportedly be followed by 28-core K-series (unlocked) models between March and April 2027, while 16-core and 8-core variants are expected to arrive between late March and May 2027. The flagship 52-core DS model is reportedly scheduled for a much later launch, potentially between late May and September 2027.Rumored Nova Lake launch timelineProcessorP-coresE-coresLPE-coresExpected launch52-core DS16324Late May to September 202728-core DS8164January to March 202728-core K-series8164March to April 202716-core484Late March to May 20278-core440Late March to May 2027While Intel is yet to officially confirm a launch date for Nova Lake, various leaks have suggested that the lineup could be one of the company's biggest generational leaps in recent years. The flagship desktop SKU, featuring a 52-core configuration, is expected to combine 16 Coyote Cove Performance (P) cores, 32 Arctic Wolf Efficiency (E) cores, and four Low Power Efficiency (LPE) cores. This would be a notable jump over the current Core Ultra 9 285K, which features a total of 24-cores. The introduction of Coyote Cove and Arctic Wolf also points to an entirely new CPU architecture, replacing the Lion Cove and Skymont cores found in Arrow Lake.Nova Lake is also rumored to bring new platform upgrades including support for DDR5-8000 memory, up to 24 PCIe 5.0 lanes for expansion, Thunderbolt 5, and Intel's next-generation Xe3 Celestial integrated graphics. The processors are also expected to feature an upgraded NPU5 for AI workloads along with a 150W Processor Base Power (PBP) and 253W Maximum Turbo Power (MTP) on the flagship model, despite the substantial increase in core count. Earlier reports have also indicated that Nova Lake will transition to a new LGA1954 socket, meaning users will likely need a new motherboard to upgrade from the existing Arrow Lake platform.
The Hot Take: ASML's monopoly needs get challenged, but not sure if Quantum will just make them invalid. We'll have to wait and see I guess.
Intel has entered high-volume manufacturing using ASML's High NA extreme ultraviolet (EUV) lithography technology for a subset of its Intel Core Ultra Series 3 "Panther Lake" processors, becoming the first company to ship high-volume logic products manufactured with the technology. ASML announced the milestone in an official press release on Wednesday, July 15, confirming that Intel Foundry is running the qualified High NA layers on its Intel 18A process node in Oregon.Go deeper with TH Premium: Chipmaking(Image credit: tsmc)A deeper look at the chipmaking supply chainTSMC's $165 billion U.S. investments examinedChina reportedly reverse-engineers EUV toolChina bets on DUV, as EUV blockade reshapes chipmakingAccording to ASML, Intel is using High NA EUV to pattern selected Intel 18A layers, with products already shipping to customers at yields matched to those achieved on ASML's existing NXE EUV platform. These layers are dual-qualified, meaning the same layer can be exposed on either an existing 0.33 NA NXE scanner or a 0.55 NA EXE scanner, with the resulting wafers being interchangeable.High NA EUV has long been viewed as the successor to today's EUV lithography, promising to extend semiconductor scaling by enabling manufacturers to print smaller, denser circuit patterns that are becoming difficult to achieve with existing tools. Until now, the platform had been confined to R&D work. ASML’s announcement marks the first time High NA EUV has been used to produce and ship a high-volume commercial logic product. Panther Lake, built on the Intel 18A manufacturing process, is spearheading this transition. Rather than replacing the company's entire lithography flow, Intel is applying High NA EUV to specific layers while the remainder of the chip continues to be manufactured using conventional lithography. High NA EUV builds on the same 13.5-nanometer extreme ultraviolet light used by today's scanners but increases the optical system's numerical aperture (NA) — how much light a lens system can collect and focus onto a silicon wafer — from 0.33 to 0.55. The higher value resolves finer features in a single exposure, allowing chipmakers to print smaller patterns with greater precision and process control.This increased resolution is expected to reduce reliance on complex multi-patterning techniques for some of the industry's most demanding layers, thereby simplifying manufacturing and improving feature fidelity. In the long term, these capabilities are expected to support higher transistor densities and improved performance in future processors, particularly as AI workloads continue driving demand for increasingly advanced semiconductor technologies."With increased resolution and better process control, the introduction of High NA EUV marks a substantial development in semiconductor lithography," said ASML President and CEO Christophe Fouquet. "We are proud to play a role in enabling the smaller, denser patterning that will accelerate advancements in AI and other emerging technologies." Intel and ASML have been working towards this milestone for several years. In 2024, Intel completed installation of one of the industry's first commercial High NA EUV lithography systems, the TWINSCAN EXE:5000, at its Hillsboro, Oregon, research and development facility. The company later became the first to qualify ASML's second-generation TWINSCAN EXE:5200B, which increases wafer throughput and overlay accuracy while incorporating an improved EUV light source over its predecessor.While the announcement represents High NA EUV's commercial debut, it does not mean Panther Lake is manufactured entirely using the new lithography platform. Instead, Intel has qualified High NA for selected layers, an approach that mirrors how new lithography generations are typically introduced into advanced semiconductor production before broader adoption across future nodes.Intel Foundry Executive Vice President and General Manager Naga Chandrasekaran said that qualifying the High NA process option on selected Intel 18A product layers enables the company's existing tool fleet to deliver higher manufacturing output while providing flexibility for future process technologies.Panther Lake itself is not a future product. Intel launched Core Ultra Series 3 at CES on January 5, 2026, opened preorders the following day, and put systems on shelves globally from January 27. The Core Ultra X9 378H followed in April alongside the value-tier Core Series 3, code-named Wildcat Lake, and the handheld-focused Arc G3 parts arrived on May 28.The announcement’s statement that the product is shipping to customers refers to wafer flow from the fab into the supply chain, rather than to a product launch. ASML says the two companies will continue working on High NA readiness, with the flexibility to incorporate the technology into future nodes based on customer needs — most immediately, Intel 14A, which Intel has designed to use High NA on a set of its tightest-pitch layers.