The Hot Take: I really wonder if this will deflate the Ai bubble even a little bit.
The x86 Ecosystem Advisory Group led by Intel and AMD recently firmed up the AI Compute Extensions (ACE) specification for optimizing x86 for AI computation tasks around matrix multiplication and the like for machine learning workloads. The cross-vendor ACE extension is ultimately a successor to Intel's Advanced Matrix Extensions (AMX). Posted to the GCC mailing list today by Intel engineers are the initial patches in preparing the compiler support for ACE...
The Hot Take: Intel Ramping things up to play catch up and win volume from TSMC.
Intel this week initiated expansion of its Bowers Campus in Santa Clara, California, in a bid to produce more photomasks (reticles) in the U.S. The company intends to build a new manufacturing facility and a new utility building at the site, which will reinforce the site's position as a key producer of photomasks for Intel.Go deeper with TH Premium: Chipmaking(Image credit: tsmc)A deeper look at the chipmaking supply chainTSMC's $165 billion U.S. investments examinedChina reportedly reverse-engineers EUV toolChina bets on DUV, as EUV blockade…
The Hot Take: Samsung playing catch up and hopefully over take TSMC? Only time will tell.
Korean chip manufacturing giant Samsung is developing simulation technologies for lithography that rely on quantum computing and artificial intelligence, suggests a report from the Korean press. The technology will be used to run simulations of the first stage of the chip manufacturing process, and Samsung will also rely on artificial intelligence to streamline the process. Through the technology, the firm aims to reduce the time and cost of the lithography and etching processes. Samsung Is Developing Algorithms To Boost Its Photolithography,…
The Hot Take: Oh so the Ultra series aren't just crap then? /smh
It's curious to call this one a leak, exactly, since the original source is direct from AMD and live on the web, but here we go: AMD's Vishal Badole submitted a patch for the Linux Kernel that he describes as adding support for "a Low Power core type, in addition to the existing Performance and Efficiency types." That's pretty clear-cut.
Now,
A new class-action lawsuit filed in California accuses SK hynix, Samsung, and Micron of coordinating DRAM production to artificially restrict supply and maintain elevated prices for consumer memory products.
The Hot Take: About time. I've been saying they should have one for a while.
The big story in computing these days is how an ongoing shortage of RAM (dubbed RAMageddon or the RAMpocalypse) has led to massive increases in hardware costs. The conventional explanation of the situation has been that shortages have been driven by the widespread construction of AI data centers. However, a new lawsuit (Garciaguirre et al. v. Samsung Electronics Co., Ltd., et al.) filed against RAM manufacturers Samsung, SK Hynix, and Micron, alleges that these companies are exploiting market conditions to artificially inflate prices.
The Hot Take: Interesting, Risc-V shop from rockstar architect Jim Keller.
Jim Keller isn't bothered by Cerebras's recent IPO and says that he welcomes it, but Tenstorrent will still beat them on everything. Tenstorrent CEO, Jim Keller, Signals Deal With Intel or Qualcomm While Promising To Beat Cerebras "on everything" Tenstorrent recently introduced its latest BlackHole Galaxy server, a system with which it can disrupt the entire AI segment, with performance levels that crush the competition. We covered the announcement last month when the company demoed its Blackhole server undercutting a NVIDIA GB300 with up to…
The Hot Take: I just hear Tim Allen in my head from tool time.
Intel is expected to push the boundaries on power draw with its upcoming Nova Lake series processors, which will rival the best CPUs. According to newly leaked information, the flagship 52-core desktop variant is expected to feature a dual-compute tile architecture with a massive PL2 limit of 474W. The information was shared by LC Tech Leaks and confirmed by Jaykihn, who has a pretty solid track record with Intel hardware.PL2, or Power Limit 2, represents the maximum power a CPU can draw during short boost periods. That said, a PL2 target of…
The Hot Take: We'll see how long before they go to Intel because TSMC is filled up in Arizona FABs.
Nvidia will stay TSMC’s biggest customer in 2027, but AMD’s EPYC Venice could pinch the CPU bragging rights.
TSMC is seeing rising demand for 2.5D advanced packaging as CPUs become more important in the agentic AI bunfight. Apparently, GPUs alone are no longer enough to feed the machine.
Morgan Stanley reckons Nvidia will remain TSMC’s largest CoWoS customer in 2027. TSMC is expected to reach wafer capacity of 200,000 wafers a month that year.
Nvidia is using TSMC’s CoWoS packaging for two main product families. CoWoS-L is for AI GPUs…