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Intel 14A defect density is dropping faster than the company expected — 'we have not seen this performance since 22nm,' says CFO

The Hot Take: Good, needed more than just for their own products but defense too.

Intel's confidence in its 14A (1.4nm-class) fabrication process is rising as defect density drops. The company's own design teams are at work developing products that will use the technology, while external customers are now asking about 14A volumes Intel can get them, according to David Zinsner, chief financial officer of Intel, who spoke at Deustche Bank's 2026 Technology Conference. The CFO went as far as saying that 14A is Intel's best process since 22nm technology from the 2010's. But while the comment is optimistic, there is a…

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Intel Rushes To Fill One Of Its Last Remaining Empty Clean Rooms Located Within Fab 38 In Israel Despite Geopolitical Risk And Lower Subsidies

The Hot Take: Filling capacity across the globe it appears. GOOD.

Intel is a hive of activity these days, so much so that it's now apparently rushing to fill its heretofore empty clean rooms while aggressively expanding capacity even in a location with relatively lower subsidies/tax credits and a much higher quantum of embedded geopolitical risk - Fab 38 in Israel. Hoffman Construction has updated its Fab 38 page to disclose 2026 as the wrap-up year of its contractual obligations, while a new Intel job vacancy for the Kiryat-Gat Site Master Planner has also opened up Back in July 2025, Intel had paused the…

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Intel Cracks The Encapsulation Wall Blocking Hyper-Large Chips, Pushing Advanced Packaging To 24x Reticle Size and Beyond

The Hot Take: Good, USA needs a strong Intel manufacturing.

Intel has overcome one big challenge that will lead to the creation of hyper-large chips beyond 12x reticle size through advanced packaging technologies. Intel Is Creating The World's Most Advanced & Largest Chips in the US at Its New Mexico "Rio Rancho" Facility, Leveraging Next-Gen Packaging Innovations Modern-day chips don't rely on a single piece of silicon, and instead utilize a range of silicon dies, interconnected together using the latest packaging solutions. The terminology used for such designs is chiplets, and chiplets were made…

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Intel Emerges as America’s Only Leading-Edge Chipmaker as RAMP-C Hands the Department of War Domestic 18A Production

The Hot Take: As it should be, given all of the other ones are own by foreign entities.

Intel has completed its RAMP-C program, which now aims to enable customers to move from test chips to domestic high-volume manufacturing. Intel RAMP-C Leads To Successful Development of a Strong "Design Enablement Infrastructure" Which Enables Commercial & Defense Customers To Design & Fabricate Chips Within the US Press Release: Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. Launched in September 2021, the program supported development of domestic, leading-edge CMOS technology…

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Intel fortifies Foundry with an actual customer: Fortinet

The Hot Take: The more the merrier and helps Intel get back to track making and developing x86 CPUs. Hopefully GPUs too.

Fortinet on Tuesday revealed it will use Intel Foundry to fab its sixth-gen Security Processor (SP6), a nice win for Chipzilla's sputtering chipmaking biz. The chips feature dedicated accelerators designed specifically for the security and cryptographic operations required by modern hardware firewalls. The custom chips are one of Fortinet's defining features. Many cybersecurity hardware players build appliances around commodity hardware like x86 and Arm CPUs, but Fortinet prefers custom application-specific integrated circuits (ASICs). The two…

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TSMC’s CFO Admits US Fabs Cost Four To Five Times More Than Taiwan, Yet Doubles Down With $100B Bet

The Hot Take: Bitch and moan, better than paying the tariffs sir.

TSMC's CFO Wendell Huang shared last week that the firm is seeing strong demand from US customers. The executive's comments came after the Taiwanese firm's latest earnings report, which also saw it announce an additional $100 billion investment in the US. Huang outlined that TSMC's 3-nanometer facilities in the US should come online by the second half of next year and added that the costs of building facilities in the US were higher than in Taiwan. TSMC CFO Says US Fabs Cost Four To Five Times More To Build Than In Taiwan TSMC's latest $100…

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Apple Reportedly Agreed to Intel Chips To Avoid White House Tariffs

The Hot Take: Makes sense, especially if China takes Taiwan....

According to the Wall Street Journal (paywalled), Apple agreed to use Intel's U.S. chipmaking plants after White House officials pressured Tim Cook during tariff-relief talks last summer. MacRumors reports: In August 2025, Apple CEO Tim Cook was in Washington to lobby the Trump administration to drop its proposed 100 percent tariff on semiconductor imports -- a levy that would have raised costs across Apple's product line. Apple reportedly secured an exemption after pledging to invest hundreds of billions of dollars in the U.S., although many…

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Jim Keller's startup is building a factory to mass-produce small semiconductor fabs —Atomic Semi rebrands as 'Fab2' underlining intended role as a 'fab fab'

The Hot Take: New Micro-FAB? Jim Keller involvement, interesting.

Atomic Semi, the semiconductor tooling startup founded by chip architect Jim Keller and DIY fabrication pioneer Sam Zeloof, has rebranded as Fab2 and moved its operations to Texas, according to the company's new site at fab2.com. The rebrand recasts the company around the idea they're calling a "fab fab," a factory that mass-produces small semiconductor fabs and the tools inside them.Fab2 designs and builds every tool in its fabs in-house, from pumps, valves, and gas lines to lithography and the vacuum chambers that house it. The company…

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Intel expands production of photomasks in California: EUV and High-NA EUV in the focal point

The Hot Take: Intel Ramping things up to play catch up and win volume from TSMC.

Intel this week initiated expansion of its Bowers Campus in Santa Clara, California, in a bid to produce more photomasks (reticles) in the U.S. The company intends to build a new manufacturing facility and a new utility building at the site, which will reinforce the site's position as a key producer of photomasks for Intel.Go deeper with TH Premium: Chipmaking(Image credit: tsmc)A deeper look at the chipmaking supply chainTSMC's $165 billion U.S. investments examinedChina reportedly reverse-engineers EUV toolChina bets on DUV, as EUV blockade…

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