83 posts
The Hot Take: Better with less change seems to be a win!
Intel is preparing to present a refined version of its 18A process technology at the VLSI 2026 Symposium, introducing the 18A-P node as an optimized variant focused on improving power and performance characteristics without altering transistor density.
Read the full articleThe Hot Take: If this can even compete with HBM4 then intel has a HUGE win.
Intel and SoftBank, through their joint venture Saimemory, are working on a new memory architecture aimed at addressing bandwidth limitations in AI accelerators.
Read the full articleThe Hot Take: Intel winning all this business just means the domestic creation of products has accelerated to me. Only way they're going to get US Government Contracts or be able to sell in the US Borders. Prime example the router ban they just enacted.
Intel continues to see increased confidence for its upcoming Foundry technologies, such as 18A-P, 14A, and EMIB. Apple & Google Will Reportedly Leverage Intel Foundry 18A-P & EMIB Technologies, 14A Customers Also Lining Up. The Agentic AI and Inferencing boom has led to a significant surge in CPU demand. This has led major semiconductor companies such as TSMC to face severe supply constraints, all the while going on a large-scale expansion spree to meet demand. At the same time, Intel has been driving revenue up by selling off salvaged dies, but the company is also attracting the attention of various […]Read full article at https://wccftech.com/intel-18a-p-pulls-in-apple-next-m-chips-emib-reportedly-wins-google-tpuv8e/
Read the full articleThe Hot Take: Will be interesting to see where this goes. I'm wondering what type of cooling/heating this will bring using this medium over what it's replacing.
Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years. Intel-Partner, Amkor, Says Glass Substrates Will See First Commercialization Within Three Years Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet growing compute and memory demands. TSMC is the single-most important advanced packaging provider in the world thanks to its CoWoS 2.5D technology. Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased […]Read full article at https://wccftech.com/intel-backed-glass-substrates-tech-will-be-commercilization-ready-within-three-years/
Read the full articleThe Hot Take: Good new as this should help stave off an Nvidia buy out but we'll have to see if it's enough.
Intel's stock price soared 24% Friday. It's the stock's largest single-day spike since since October 1987, reports CNBC, "as investors cheered signs of renewed growth due to mounting artificial intelligence demand." The stock closed at $82.57 and is now up 124% this year after jumping 84% in 2025. Friday's rally topped a 23% gain for the stock on Sept. 18, when Nvidia agreed to invest $5 billion in the company... "INTC's new CEO fixed the balance sheet, and is executing on a strategy that appears to have put INTC back on the competitive track," analysts at Evercore ISI wrote in a report after earnings, upgrading the shares to the equivalent of a buy rating. First-quarter revenue topped estimates and rose 7.2% to $13.58 billion from $12.67 billion a year earlier. In five of the prior seven quarters, the company posted year-over-year declines in revenue... The rally on Wall Street marks a stark turnaround for the U.S. chipmaker, which lost 60% of its value in 2024, leading to the ouster of Pat Gelsinger as CEO in December of that year... Intel's data center business is driving much of the current growth. Revenue jumped 22% from a year earlier to $5.1 billion, as AI fuels renewed demand for central processing units. Analysts at Citi upgraded the stock to a buy from a neutral rating, anticipating an uplift in CPU sales for all suppliers over the next few years. Besides Tesla, Intel's CEO said Thursday that "multiple customers" are "actively evaluating the technology" their new 14A chip technology, according to CNBC, and that 14A development is happening faster than its 18A technology. The sudden spike in Intel's stock price makes the stock chart look almost like a straigbht line up. Last August it was selling for less than $20 a share — so it's quadrupled in value less that nine months. Read more of this story at Slashdot.
Read the full articleThe Hot Take: Not good, but then again would need to happen if Nvidia is planning on buying intel. We all loose a third wheel market option and we're going to continue having high prices.
New leaks claim that Intel's upcoming Xe3P graphics architecture won't feature any discrete gaming GPUs, and even the next-gen Xe4 lineup isn't confirmed to. Intel is instead prioritizing the datacenter and workstation segments for new graphics IP, and is featuring them on mobile parts.
Read the full articleThe Hot Take: It appears they definitely woke a sleeping giant....
Intel's next-gen Xeon "Diamond Rapids" CPUs will offer up to 512 cores, while Coral Rapids will bring back SMT on 8-channel platforms in 2028. Intel Diamond Rapids 16-Channel Slips Into 2027, Features Up To 512 Cores Intel Diamond Rapids "Xeon" CPUs were going to launch this year, but delays in plans have pushed it to 2027. The delay can be attributed to several reasons, such as yields and the fact that the 8-channel line was cancelled. Now, Intel plans to launch Diamond Rapids "Xeon" CPUs in 2027. As per Jaykihn, Intel's mid-2027 plans for Diamond Rapids include a volume launch […]Read full article at https://wccftech.com/intel-diamond-rapids-xeon-2027-512-cores-16-channel-memory-coral-rapids-smt-in-2028/
Read the full articleThe Hot Take: This is just a very inserting move as it cannibalizes the range of SKUs for the lower end builds. Question is will they be charging same for the chipset but tweaking the firmware for USB ports, SATA and PCIe lane configurations for lower priced boards? Only time will tell. This does bring us back to the days where they didn't have several chipsets and board manufacturers has a bit more control of their boards features.
According to the latest leaks, Intel's next-gen Nova Lake desktop CPUs will see a bit of a shake-up in their motherboard chipset market segmentation strategy. The usual source for Intel leaks, Jaykihn, says that the next-gen Z970 chipset will "replace most of the market currently covered by the B860." However, a B960 chipset is still on the
Read the full articleThe Hot Take: Great news as we need healthy competition for x86 in a world being crowded by ARM SoC chips. We'll see soon which architecture wins out but we still have RISC-V around the corner, where intel is a board member of that ISA. I feel this limiting ram on devices might be to push in ARM/RISC into acceptance...
Demand for Intel's products exceed expectations and supply, but Intel is still bleeding money.
Read the full articleThe Hot Take: HBM competitor would be good bringing Ai accelerator competition for RAM. Intel bringing it should help Intel to catch up in the Ai game for sure.
Japan’s SaiMemory, a SoftBank subsidiary collaborating with Intel, has secured NEDO funding to develop Z-Angle Memory (ZAM), a next-gen DRAM architecture addressing HBM limitations
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