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Arm and AMD eye agentic AI CPU feast

The Hot Take: So was ARM not breaking into the WinTel market so they shifted to Ai market or are they just chasing the highest dollars?

Investment bank UBS reckons agentic AI will send CPU demand soaring, with Arm and AMD best placed to grab the spoils. UBS analysts believe the growth of agentic AI software will drive strong demand for CPUs in the AI era. The bank said agentic AI increases processor workloads and favours chips with higher core counts and better power efficiency. That view gives Arm the biggest potential upside, followed by AMD. Intel could benefit too, since a growing total addressable market tends to lift more than one silicon boat. In fresh coverage of British chip design house Arm, UBS said CPU demand is surging. The bank said agentic AI computing will favour chips with higher core counts and a bias towards power efficiency. UBS reckons the total server market could grow five times by calendar year 2030. It put the figure at $170bn, up from $30bn in calendar year 2025. Within that market, UBS expects Arm to benefit the most. The bank said Arm could potentially grab as much as 40-45 per cent of the total share, which would make the x86 crowd choke on its roadmaps. The bank’s report cited expert comments behind three main themes explaining the surge in CPU demand. The first is that agentic AI workloads rely more heavily on CPU cores. That shift is expected to require a three- to fivefold increase in CPU core counts per user and per GPU. Servers with standalone CPUs will need more chips, which is the kind of problem chip sellers enjoy having. UBS said that demand for agentic AI will push some workloads to local PCs. It pointed to Anthropic’s Claude Code as an example. The need for higher core counts and power efficiency should tilt demand first towards Arm and then AMD. That sounds grim for anyone still selling yesterday’s watt-guzzling boxes as tomorrow’s AI answer. Chipzilla could still serve this market through its Coral Rapids platform, according to UBS. The catch is that benefiting from a bigger market and winning the best bits of it are not quite the same trick.  

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Intel's ZAM Memory Threatens HBM's AI Throne With 2x The Bandwidth of HBM4, More Capacity & Low Thermal Constraints

The Hot Take: If this all is true they have a winner on their hands.

Intel's Z-Angle Memory (ZAM) is approaching completion as it races towards taking a bite at the AI boom while challenging HBM as a viable alternative. Intel's ZAM Challenges HBM As A Big Memory Innovation In the High-Bandwidth, High-Capacity Segment Offering 2x The Speed of HBM4 Z-Angle Memory or ZAM has been stirring up a lot of talk in the memory segment. The upcoming memory standard is being developed by Intel and SoftBank & aims to offer a low-power, high-density replacement to HBM. Now, new details have been shared that provide more insight into ZAM memory. For starters, the new memory […]Read full article at https://wccftech.com/intel-zam-memory-threatens-hbms-ai-throne-with-2x-the-bandwidth-of-hbm4/

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Tenstorrent Vows to ‘Crush Everyone’ as Galaxy Blackhole Hits 350 Tokens/s on DeepSeek R1, Undercutting NVIDIA’s GB300 5x AI TCO

The Hot Take: RISC-V breaking the GPU strangle hold on GPU's? YES PLEASE.

Tenstorrent made a bold claim during their TT-Deploy livestream, saying they are going to crush everyone at everything, including AI, with their Galaxy servers. Tenstorrent Galaxy Supercluster Offers 10x Faster GenAI Video, And Destroys Current-Gen GPUs With "Blitz Mode", Offering 350+ Tokens/s In DeepSeek R1 Jim Keller and his Tenstorrent are on a mission to challenge the existing AI hierarchy with their RISC-V-powered platforms. As such, the company unveiled its latest Galaxy Blackhole servers for AI at scale. With Galaxy Blackhole, Tenstorrent offers a fully Networked and native AI solution that includes compute, memory, and networking, all unified into a […]Read full article at https://wccftech.com/tenstorrent-vows-to-crush-everyone-galaxy-blackhole-hits-350-tokens-on-deepseek-r1-undercut-nvidia-gb300-ai-tco/

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Intel & AMD Work On APX, The Next Major Step In The Evolution of x86 Architectures, Adds More Performance Without Requiring More Die Area & Power

The Hot Take: Just what we need Ai specific instructions for them to gobble up all the CPU's now.

APX or Advanced Performance Extensions are the next evolution of x86 as Intel & AMD co-develop new standards for the architecture. APX Expands the x86 Instruction Set, Bringing Faster Performance & New Features That Will Benefit Both Intel and AMD's Next-Gen Chips Two days ago, we talked about ACE (AI Compute Extensions), which is a unified instruction set that aims to increase matrix-multiply performance for next-gen x86 chips. ACE is just one part of the grander scheme in which both Intel and AMD are working together to evolve the x86 architecture under a single unified framework through the recently established […]Read full article at https://wccftech.com/intel-amd-work-on-apx-the-next-major-step-in-the-evolution-of-x86-architectures/

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SoftBank subsidiary working with Intel to develop radical new ZAM memory is now receiving Japanese gov't subsidies — new memory designed as a lower-power HBM for AI workloads

The Hot Take: HBM competitor would be good bringing Ai accelerator competition for RAM. Intel bringing it should help Intel to catch up in the Ai game for sure.

Japan’s SaiMemory, a SoftBank subsidiary collaborating with Intel, has secured NEDO funding to develop Z-Angle Memory (ZAM), a next-gen DRAM architecture addressing HBM limitations

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Bolt Graphics Tapes Out Zeus GPU, Targets HPC with Bold RTX 5090 Claims

The Hot Take: We all desperately need this to not be vapor-ware!

A relatively unknown U. S. -based startup, Bolt Graphics, has announced that it has successfully taped out the first test chip of its Zeus GPU architecture. The company positions Zeus as a disruptive compute accelerator, previously claiming performance up to 150% higher than an NVIDIA GeForce RTX 5090 while consumi ...

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Elon Musk says his TeraFab facilities will use Intel's 14A process technology to make AI chips — SpaceX will be responsible for high-volume chip manufacturing in likely Intel tech licensing deal

The Hot Take: Intel needs this licensing support as other law suits are back in court with patent trolls....

Elon Musk reveals details about TeraFab: Intel provides technology, Tesla builds pilot line, SpaceX constructs high-volume fab.

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AMD Taps GlobalFoundries for MI500’s Co-Packaged Optics as the Silicon Photonics Race With NVIDIA Heats Up

The Hot Take: Getting cozier with your previous manufacturing division in a previous life.

AMD will be leveraging GlobalFoundries for the development of its MRM Co-packaged Optic solution for the next-gen Instinct MI500 AI accelerators. GlobalFoundries & AMD Working Together on Co-Packaged Optics Hardware For Instinct MI500 Accelerators CPO or Co-Packaged Optics (Silicon Photonics) is the next-generation solution that reduces reliance on copper and harnesses light to transfer signals. These CPOs are packaged alongside hardware accelerators such as GPUs and will be a key solution for next-gen AI factories, offering improved interconnect latency and creating high-bandwidth connections between CPU and GPU. Both AMD and NVIDIA will be leveraging these technologies for their next-gen AI […]Read full article at https://wccftech.com/amd-taps-globalfoundries-for-mi500-co-packaged-optics/

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AMD 3D V-Cache Turns Ryzen Into a Surprise RAG AI Weapon, With An 88% Boost Over Non-X3D CPUs

The Hot Take: Seems it was only time with these chips.

AMD's 3D V-Cache CPUs deliver a huge boost versus the Non-X3D part in AI benchmarks, showcasing why they are best suited for RAG pipelines. AMD 3D V-Cache Vs Non 3D V-Cache CPU Benchmarks in AI Showcase a Massive Uplift For RAG Pipelines We know that there are two ways to do AI: the first is LLM, which is currently the most popular model. LLMs are AI models that have been pre-trained on a large set of data and feature various parameter sizes. But LLMs' limitations can be seen when it needs to generate responses on data it wasn't trained on. […]Read full article at https://wccftech.com/amd-3d-v-cache-turns-ryzen-into-surprise-rag-ai-weapon-88-percent-boost-vs-non-x3d/

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Allbirds abandons clothes, pivots to "AI compute infrastructure"

The Hot Take: Interesting shift in markets....

If you know the name Allbirds, it's probably for the company's longstanding stated commitment to "sustainable shoes and apparel." Going forward, though, the corporate entity wants to be known for its "long-term vision to become a fully integrated GPU-as-a-Service (GPUaaS) and AI-native cloud solutions provider." In a news release Wednesday morning, Allbirds announced that it has secured a $50 million convertible finance facility to help power this unexpected "pivot ... to AI compute infrastructure." If all goes to plan, the company will soon be known as NewBird AI, by which point it will presumably change the image of a spandex-clad hiker that still sits atop its News Release page. Just weeks ago, Allbirds announced the $39 million sale of the "Allbirds brand and footwear assets" to American Exchange Group, owner of Aerosoles, Ecko Unlimited, and other fashion brands. Today's AI pivot announcement certainly casts that sale in a new light. But Allbirds also announced a new line of colorful Canvas Cruiser shoes just last week, so it's unclear how much long-term planning went into this new AI-related direction.Read full article Comments

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