The Hot Take: Bitch and moan, better than paying the tariffs sir.
TSMC's CFO Wendell Huang shared last week that the firm is seeing strong demand from US customers. The executive's comments came after the Taiwanese firm's latest earnings report, which also saw it announce an additional $100 billion investment in the US. Huang outlined that TSMC's 3-nanometer facilities in the US should come online by the second half of next year and added that the costs of building facilities in the US were higher than in Taiwan. TSMC CFO Says US Fabs Cost Four To Five Times More To Build Than In Taiwan TSMC's latest $100…
The Hot Take: ASML's monopoly needs get challenged, but not sure if Quantum will just make them invalid. We'll have to wait and see I guess.
Intel has entered high-volume manufacturing using ASML's High NA extreme ultraviolet (EUV) lithography technology for a subset of its Intel Core Ultra Series 3 "Panther Lake" processors, becoming the first company to ship high-volume logic products manufactured with the technology. ASML announced the milestone in an official press release on Wednesday, July 15, confirming that Intel Foundry is running the qualified High NA layers on its Intel 18A process node in Oregon.Go deeper with TH Premium: Chipmaking(Image credit: tsmc)A deeper look at…
Intel is reportedly making a significant change to the manufacturing strategy for its upcoming Nova Lake processor family by shifting the majority of compute tile production back to Intel Foundry.
The Hot Take: Makes sense, especially if China takes Taiwan....
According to the Wall Street Journal (paywalled), Apple agreed to use Intel's U.S. chipmaking plants after White House officials pressured Tim Cook during tariff-relief talks last summer. MacRumors reports: In August 2025, Apple CEO Tim Cook was in Washington to lobby the Trump administration to drop its proposed 100 percent tariff on semiconductor imports -- a levy that would have raised costs across Apple's product line. Apple reportedly secured an exemption after pledging to invest hundreds of billions of dollars in the U.S., although many…
The Hot Take: New Micro-FAB? Jim Keller involvement, interesting.
Atomic Semi, the semiconductor tooling startup founded by chip architect Jim Keller and DIY fabrication pioneer Sam Zeloof, has rebranded as Fab2 and moved its operations to Texas, according to the company's new site at fab2.com. The rebrand recasts the company around the idea they're calling a "fab fab," a factory that mass-produces small semiconductor fabs and the tools inside them.Fab2 designs and builds every tool in its fabs in-house, from pumps, valves, and gas lines to lithography and the vacuum chambers that house it. The company…
The Hot Take: Intel Ramping things up to play catch up and win volume from TSMC.
Intel this week initiated expansion of its Bowers Campus in Santa Clara, California, in a bid to produce more photomasks (reticles) in the U.S. The company intends to build a new manufacturing facility and a new utility building at the site, which will reinforce the site's position as a key producer of photomasks for Intel.Go deeper with TH Premium: Chipmaking(Image credit: tsmc)A deeper look at the chipmaking supply chainTSMC's $165 billion U.S. investments examinedChina reportedly reverse-engineers EUV toolChina bets on DUV, as EUV blockade…
The Hot Take: Samsung playing catch up and hopefully over take TSMC? Only time will tell.
Korean chip manufacturing giant Samsung is developing simulation technologies for lithography that rely on quantum computing and artificial intelligence, suggests a report from the Korean press. The technology will be used to run simulations of the first stage of the chip manufacturing process, and Samsung will also rely on artificial intelligence to streamline the process. Through the technology, the firm aims to reduce the time and cost of the lithography and etching processes. Samsung Is Developing Algorithms To Boost Its Photolithography,…
The Hot Take: We'll see how long before they go to Intel because TSMC is filled up in Arizona FABs.
Nvidia will stay TSMC’s biggest customer in 2027, but AMD’s EPYC Venice could pinch the CPU bragging rights.
TSMC is seeing rising demand for 2.5D advanced packaging as CPUs become more important in the agentic AI bunfight. Apparently, GPUs alone are no longer enough to feed the machine.
Morgan Stanley reckons Nvidia will remain TSMC’s largest CoWoS customer in 2027. TSMC is expected to reach wafer capacity of 200,000 wafers a month that year.
Nvidia is using TSMC’s CoWoS packaging for two main product families. CoWoS-L is for AI GPUs…
The Hot Take: More manufacturing states side is good.
Samsung Electronics' foundry plant in Taylor, Texas, is showing signs of moving into equipment-level execution. Key engineers from ASML Korea, the Dutch lithography equipment giant's South Korean unit, have been dispatched to the Taylor facility and are expected to remain on site for roughly six to eight weeks, according to Korean industry publication DealSite.