The Hot Take: Another company given x86 tech? Will it go the way of VIA, or will they run and enhance it to bring a 4th strong competitor to the x86 ISA market?
Intel is handing Atom chip IP to Rosaic, a startup run by one of Lip-Bu Tan’s old mates, Amarjit Gill.
Gill has history with Intel chief executive Lip-Bu Tan, who has spent years as a semiconductor investor as well as an industry operator.
According to Reuters, Gill invested with Tan in high-performance chip startup Nuvia and worked with him on RISC-V chip outfit Rivos. Chipzilla’s Atom chips are built for low-power jobs, where they mostly scrap with designs from British chip blueprint outfit Arm.
At one point, Chipzilla aimed Atom at Android devices through a partnership with Google, before that plan went pear-shaped.
The latest Atom chips arrived in the first quarter of 2026, after Chipzilla refreshed its P-series line. Those chips are aimed at server and networking jobs.
The refresh followed the announcement of two new Atom X series chips in the third quarter of 2025. Reuters said Chipzilla will transfer register-transfer level code for Atom processors to Rosaic.
That RTL code describes how input data moves through CPU registers before turning into output, which is proper crown-jewels stuff.
It seems likely that sharing would give Rosaic deep access to Chipzilla’s intellectual property and help it build custom chips. That makes the arrangement more interesting than a routine licence deal, especially given Gill’s ties to Tan.
Tan joined Chipzilla in 2025 and is trying to turn the company around through AI and its battered foundry business. Chipzilla and AMD remain the world’s biggest designers and sellers of x86 chips.
China’s Shanghai Zhaoxin Semiconductor and Hygon Information Technology serve China’s domestic market for personal computing chips.
Under Tan, Chipzilla wants to ride the need for agentic AI computing, where traditional processors could get another spell in the sun.
The Hot Take: APU is the cousin of ARM's SoC. Mid-range across the board if you ask me is what I'm seeing the industry shifting to.
Intel is reportedly developing a socketed Nova Lake-S processor with substantially stronger integrated graphics than recent desktop Core products. Information attributed to hardware leaker Jaykihn describes a configuration with twelve Xe3P graphics cores.
The Hot Take: Hopefully better implemented to prevent all the exploits of the past.
Hyper-Threading is what Intel calls its implementation of what is more academically known as "Simultaneous Multi-Threading" (SMT). This describes a method where a single processor core can interleave processing of two or more separate program threads, usually delivering an overall performance uplift on multi-threaded tasks. Intel killed off
Intel CEO Lip-Bu Tan has acknowledged that the semiconductor giant must catch up to rivals AMD and Arm, and said it now assumes edge AI and robotics will be a business as big as PCs. Tan made those remarks during Intel’s Q2 earnings call, which saw the company report $16.1 billion revenue – a 25 percent year-on-year increase. “Q2 was another quarter of solid execution,” the CEO said. “Revenue, gross margin, and earnings per share were above our guidance. This marks the seventh consecutive quarter of exceeding our financial expectations.” Yet it didn’t deliver a profit as Intel reported a GAAP loss of $11 billion (and a non-GAAP loss of $2.2 billion). Tan remained optimistic about Intel’s prospects, thanks to the AI boom spurring demand for many of its products, and its foundry service. “Our core server CPU franchise is growing faster than ever,” the CEO said, before observing the Xeon 6 range “continues to be one of the fastest-ramping products in Intel's history.” That may be the case, but Intel’s hyperscale customers have designed their own Arm-powered CPUs and are deploying so many that analyst firm IDC recently found non-x86 servers now account for almost half of all sales. Intel’s great rival, AMD, has grown its market share to a third of the x86 server market. During the earnings call, Morgan Stanley analyst Joe Moore asked Tan how he plans to regain market share. Tan pointed to Intel’s forthcoming Clearwater Forest, Diamond Rapids, and Coral Rapids processors as evidence the company is creating products that can compete with anyone. “Some areas we are still behind,” he admitted, “but we are catching up very fast and we try to leapfrog some of the CPU architecture, and we are putting major effort into it. Time will tell.” Tan is also pondering time in terms of how component shortages impact the company’s sales and revenue. “The industry is facing one of the most severe supply constraints in its history, across leading-edge logic silicon wafers, memory, and substrates,” he said. “These shortages will persist for the foreseeable future.” Intel is of course a big player in the semiconductor supply chain, and Tan offered the happy news that wafer output across its major manufacturing nodes exceeded expectations from 90 days ago, and that yields from its leading-edge 18A process “are trending ahead of targets.” The CEO also said, “supply remains very tight and the near-term linearity of our supply growth is more skewed towards the end of Q3 and into Q4, especially for servers.” He had slightly better news about Intel’s foundry business, which is developing an advanced manufacturing process called 14A that could make Chipzilla a more formidable competitor to TSMC. “We remain on track for 14A risk production for our internal products in the second half of 2027, and we made the decision in Q2 to fully commit to high volume ramp in 2028,” Tan said. Intel’s current flagship 18A process is also going well. “In our core PC client segment, Intel 18A is now in volume production across multiple commercial and consumer products,” Tan said. “Our factory output continues to increase sequentially every month. The successful high volume ramp of 18A for our internal products provides important validations as Intel Foundry engages with external customers.” The CEO added his view that “We still have work to do to establish a strong footprint in the edge and physical AI ecosystem but see this opportunity as an important future growth driver.” So important that Intel recently renamed its PC business the “Client Computing and Physical AI Group” (CCPG). That change is more than cosmetic, because CFO David Zinsner said Intel believes “the edge and physical AI opportunity is likely to at least match the client TAM [total addressable market] over time.” That would make edge and physical AI an $8 billion business, given that in this quarter Intel said ten percent of CCPG’s $8.9 billion revenue came from edge products. Overall CCPG revenue rose 13 percent year-over-year, growth that Intel found pleasantly surprising. Zinsner said the PC market is “softer” in part due to “the memory dynamics in the marketplace,” and predicted Q3 performance will fall. ®
The Hot Take: Long wait for the next build I guess.... LOVIN' the Antec Flux Nocua edition until then I guess.
Intel was expected to unveil its next-generation desktop processors later this year. The upcoming Nova Lake lineup has been making the rounds online, and a new report from VideoCardz suggests that Intel could introduce it under the Core Ultra Series 400 branding. For context, the current Arrow Lake and Arrow Lake Refresh desktop CPUs follow the Core Ultra Series 200 naming scheme, while Intel's latest Panther Lake mobile processors carry the Core Ultra Series 300 branding.Go deeper with TH Premium: CPU(Image credit: Tom's Hardware)CPU scaling with DLSSRyzen to the top: How AMD innovated in the gaming CPU marketHow ARM is working its way into PCsAMD CES 2026 gaming trends press Q&A roundtable transcriptThe report also claims to reveal the review embargo windows and launch timeline for several Nova Lake models. According to the report, Intel will initially introduce a 28-core DS package, which is expected to launch between January and March 2027. The new DS suffix is said to be an internal package designation for processors featuring dual-compute tiles. This will reportedly be followed by 28-core K-series (unlocked) models between March and April 2027, while 16-core and 8-core variants are expected to arrive between late March and May 2027. The flagship 52-core DS model is reportedly scheduled for a much later launch, potentially between late May and September 2027.Rumored Nova Lake launch timelineProcessorP-coresE-coresLPE-coresExpected launch52-core DS16324Late May to September 202728-core DS8164January to March 202728-core K-series8164March to April 202716-core484Late March to May 20278-core440Late March to May 2027While Intel is yet to officially confirm a launch date for Nova Lake, various leaks have suggested that the lineup could be one of the company's biggest generational leaps in recent years. The flagship desktop SKU, featuring a 52-core configuration, is expected to combine 16 Coyote Cove Performance (P) cores, 32 Arctic Wolf Efficiency (E) cores, and four Low Power Efficiency (LPE) cores. This would be a notable jump over the current Core Ultra 9 285K, which features a total of 24-cores. The introduction of Coyote Cove and Arctic Wolf also points to an entirely new CPU architecture, replacing the Lion Cove and Skymont cores found in Arrow Lake.Nova Lake is also rumored to bring new platform upgrades including support for DDR5-8000 memory, up to 24 PCIe 5.0 lanes for expansion, Thunderbolt 5, and Intel's next-generation Xe3 Celestial integrated graphics. The processors are also expected to feature an upgraded NPU5 for AI workloads along with a 150W Processor Base Power (PBP) and 253W Maximum Turbo Power (MTP) on the flagship model, despite the substantial increase in core count. Earlier reports have also indicated that Nova Lake will transition to a new LGA1954 socket, meaning users will likely need a new motherboard to upgrade from the existing Arrow Lake platform.
Intel is reportedly making a significant change to the manufacturing strategy for its upcoming Nova Lake processor family by shifting the majority of compute tile production back to Intel Foundry.
The Hot Take: Was almost like they were purposefully crippling their processors under past management.
Intel Nova Lake CPUs will mark the return of AVX-512, a feature that has long been abandoned by the company for its client CPUs. AVX-512 Is Coming Back To Intel's Consumer CPUs, Starting With Nova Lake Intel has had a love-hate relationship with AVX-512 on its consumer CPUs. The AVX-512 instruction set was last seen on Intel's Tiger Lake (11th Gen) family, and since then, the company has offered no support for it on its modern-day chips. Meanwhile, AMD has been offering AVX-512 support on its Zen 4 and Zen 5 chips, both client and server platforms. Last year, we […]Read full article at https://wccftech.com/intel-nova-lake-cpus-to-bring-back-avx-512-support-six-years-after-it-was-abandoned/
The Hot Take: Oh so the Ultra series aren't just crap then? /smh
It's curious to call this one a leak, exactly, since the original source is direct from AMD and live on the web, but here we go: AMD's Vishal Badole submitted a patch for the Linux Kernel that he describes as adding support for "a Low Power core type, in addition to the existing Performance and Efficiency types." That's pretty clear-cut.
Now,
The Hot Take: I just hear Tim Allen in my head from tool time.
Intel is expected to push the boundaries on power draw with its upcoming Nova Lake series processors, which will rival the best CPUs. According to newly leaked information, the flagship 52-core desktop variant is expected to feature a dual-compute tile architecture with a massive PL2 limit of 474W. The information was shared by LC Tech Leaks and confirmed by Jaykihn, who has a pretty solid track record with Intel hardware.PL2, or Power Limit 2, represents the maximum power a CPU can draw during short boost periods. That said, a PL2 target of 474W remains quite demanding, although a previous rumor suggests Intel may also have a PL4 emergency power limit over 700W. It is important to note that these power limits may only apply to the top-end models with the dual-tile architecture.Additionally, the leak also sheds light on the upcoming platform, including the previously rumored LGA1954 socket. We already know that Nova Lake-S will require a new generation of motherboards. Motherboard vendors are expected to classify their boards by sustained PL1 power levels, with configurations for 35W, 65W, 125W, and 175W CPUs. Enthusiast-grade motherboards, likely the Z990 series, are also rumored to feature three EPS 8-pin CPU power connectors instead of the traditional two. While vendors will have the option to include a third connector, its primary purpose would be to support extreme overclocking and would not affect the CPU's rated performance profile.The upcoming Nova Lake-S lineup is expected to carry the ‘Core Ultra 400S’ moniker and will be Intel's biggest desktop CPU overhaul in years. We’ve previously reported leaked specifications indicating configurations ranging from 6 to 52 cores, with support for DDR5-8000 memory. The flagship 52-core model is expected to feature 16 performance cores, 32 efficiency cores, and a new Big Last Level Cache (bLLC) design to take on AMD's 3D V-Cache gaming dominance. The company is also rumored to introduce integrated Xe3 graphics, Thunderbolt 5, PCIe 5.0 connectivity, and an upgraded NPU for AI workloads.While these specifications are unconfirmed, it is clear that Intel is targeting substantial gains in gaming, multi-threaded performance, and overall platform capabilities with its next-gen processors.
The Hot Take: Why did it disappear in the first place?
AMD has confirmed that it will restore Transparent Secure Memory Encryption (TSME) support on consumer Ryzen processors after previously removing the feature through AGESA firmware updates.