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Tensordyne's 3nm Napier AI Chip Promises 13x Higher Token Throughput Than Blackwell & Blazes Past Rubin With 1000 Tokens/s In Multi-Trillion Parameter Models

The Hot Take: I really hope something comes soon to alleviate all this nonsense AI is causing.

US-based AI company, Tensordyne, has announced the successful tape-out of its Napier chip, which it claims to demolish NVIDIA's Blackwell & Rubin chips with leading token throughput and efficiency. Tensordyne’s new Napier AI Chip arrives with one clear mission: to make NVIDIA’s Blackwell and Rubin chips look considerably less impressive The Napier chip will be the core component of the Tensordyne Napier TDN system, which is designed in collaboration with Broadcom and HPE Juniper Networks. The Napier platform has one goal: to unify AI through novel logarithmic AI math, a tightly integrated memory architecture, and a high-performance scale-up interconnect that […]Read full article at https://wccftech.com/tensordyne-3nm-napier-ai-chip-13x-higher-token-throughput-blackwell-blazes-past-rubin/

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Intel’s Serpent Lake SoCs With NVIDIA RTX GPU Tiles Reportedly Arrive In Q1 2028

The Hot Take: This is an interesting collaboration between the two seeing intel keeps saying they're not going to stop GPU development.

Intel's Serpent Lake SoCs featuring NVIDIA's RTX GPU tiles as integrated graphics are expected to roll out by Q1 2028. Intel & NVIDIA's Co-Developed Serpent Lake SoCs Featuring Next-Gen CPU & GPU Architectures Rumored For Q1 2028 Last year, Intel announced that it was working with NVIDIA on a custom SoC that would incorporate NVIDIA's RTX GPU tiles. Intel stated that these SoCs will power a wide range of PCs that require the integration of these levels of CPUs & GPUs together into a single package. It looks like we have our first timeline of when these SoCs will be […]Read full article at https://wccftech.com/intel-serpent-lake-socs-with-nvidia-rtx-gpu-tiles-reportedly-arrive-in-q1-2028/

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SK Hynix to boost memory production 3x ... you can wait another 8 years, right?

The Hot Take: I really feel we need an investigation into all these memory manufacturers as I feel they aren't allocating all this ram for Ai like they way they are. History just repeating its self I think.

Amid the unrelenting demand for AI infrastructure, SK Hynix, the world’s largest supplier of HBM memory used in high-end GPUs, now expects to triple its wafer capacity. You'll just have to wait through two more US presidential elections and then some. All that capacity won’t come online until 2034, SK Group Chairman Chey Tae-won told Nikkei Asia in a recent interview. SK Hynix’s valuation has soared in recent months. The company is one of three major producers of NAND flash and DRAM memory, large quantities of which are required to support the burgeoning AI inference market. Samsung and Micron are the other two major players in this space. This demand has led to skyrocketing memory prices for consumer DRAM and SSDs, some of which have more than tripled in price compared to this time last year. SK Hynix and the other major memory makers meanwhile have seen their revenues explode. Chey's comments come just a week after SK Hynix said that it planned to double its production capacity within the next five years. “Our calculations show that our wafer capacity will double within five years. But honestly once all these facilities are built, it won’t just double, it will triple by around 2034,” Chey told Nikkei. SK is in the process of bringing four additional wafer fabs online, with the first phase reportedly on track to come online as early as 2027. The South Korean memory slinger had previously planned to ramp production of these facilities over the next two decades, but has pulled in its timeline in hopes of satiating AI’s memory addiction. “There is currently no way to move faster than this,” Chey told the newswire. While much of this capacity will be built on SK’s home turf, the company is exploring its options for overseas manufacturing, with Japan being one of the potential destinations, with Chey calling it an “excellent” candidate due to its robust semiconductor supply chains. Unfortunately, the buildout is unlikely to drive down memory prices for consumers any time soon. As we previously reported, memory prices are not expected to peak until later this year at the earliest. Analysts warn that memory prices are more likely to plateau going into 2027 rather than plummeting like we’ve seen in past DRAM and NAND boom-bust cycles. These boom-bust cycles have been a fact of life for commodity electronics manufacturers, like SK Hynix and Samsung, for years. Prices typically spike as inventories are drawn down and crater as new capacity is brought online. On the one hand, AI infrastructure demand has helped to stabilize this to some extent. On the other hand, the AI boom kicked off in 2022 at what was arguably the worst possible time. "This demand started in the Valley for the DRAM industry. That makes financially trying to build additional capacity really challenging," TechInsights analyst James Sanders told El Reg late last year. Business is once again booming for memory vendors presenting ample opportunities for labor disputes over competition as well as fab expansions. Unfortunately, there’s no changing the fact that the fastest anyone can bring a leading edge memory fab online is about three years. ®

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Microsoft Surface Flaw Allowed Unprotected Devices To Be Bricked By a Single Packet

The Hot Take: Ouch!

Longtime Slashdot reader Dotnaught shares a report from The Register: For the past 90 days, Microsoft has been quietly patching a firmware flaw in Surface devices that allowed the hardware to be bricked with a single packet, though only for those who have disabled Secure Core and Secure Boot. And the company's Copilot AI software inadvertently helped identify the faulty firmware. According to Jack Darcy, a security researcher based in Australia, his instance of Microsoft Copilot stumbled across the bug after being asked to adjust the screen backlighting on a Surface device. The Copilot-conjured Python script ended up rendering the researcher's laptop inoperable by overwriting the embedded controller firmware. "Copilot autonomously created and executed four progressively aggressive Python scripts during a probe for backlight control values that sent raw SSAM ioctl commands (SSAM_CDEV_REQUEST = 0xC028A501) directly to the SAM microcontroller through the SAM software path," Darcy explained to The Register. [...] "We appreciate the work of Jack Darcy and The Register for reporting this issue under a coordinated vulnerability disclosure," a Microsoft spokesperson said in a statement. "Our investigation found that a deprecated UEFI interface could trigger a boot loop on some devices. To trigger this loop, the user must have administrator privileges and have already disabled the Secure Boot security feature. We have released updates to address the issue for most impacted devices." That means managed devices are not at risk. But those using Linux, or Windows users who have disabled Secure Core and Secure Boot for gaming, or who use custom Windows drivers, or who have USB boot enabled, may still be vulnerable if their systems haven't received the update. We're uncertain about the range of Surface devices affected. Our source said it appears to be all of them (Surface Laptops 3-6, Surface Book 1-3) except for Surface Go models. ARM variants, however, have not been tested. The report notes that Microsoft is planning to move the Surface stack to a more secure architecture based on Rust code. "Our most recent Surface for Business hardware features a major architectural shift in terms of improved reliability and security that spans our embedded controller, UEFI, but also some of our drivers," said David Abzarian, chief architect for Microsoft Surface. "We're investing in the most secure foundation for a PC by building our embedded controller firmware from the ground up in Rust (as part of leveraging and contributing to the Open Device Partnership (ODP)) in addition to a rewrite of the UEFI DXE Core in Rust; these projects are known as Secure EC and Project Patina respectively." "We're also not only shipping some of our drivers written in Rust, but also helping co-develop the framework Windows Drivers in Rust (WDR) to help enable a broad set of partners in the Windows ecosystem to capitalize on these benefits. I will also note that all of these efforts are open-source promoting one of our key security principles around transparency." Read more of this story at Slashdot.

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Apple Is 100% All-In On A Touchscreen MacBook, Leaker Says

The Hot Take: Mobile convergence is almost complete on the apple front.

Apple is without a doubt planning to launch a MacBook that finally incorporates touch support on its display, according to a prominent leaker on Weibo. The long overdue feature would bring parity to a litany of Windows laptops and Chromebooks that have used touchscreen displays for years, and would likely be a popular selling point on future

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AWS Graviton5 Debuts with 192 Arm Cores and PCIe 6.0

The Hot Take: ARM seems to be breaking out from everywhere. Fujitsu, Nvidia, AWS and ARM. Qualcomm seems to be playing catch up in the server market from the looks of it.

AWS has provided a first look at its next-generation Graviton5 processor, a custom server CPU developed by Annapurna Labs for deployment across the company's cloud computing platform and AI inference infrastructure.

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Maxsun Intel Arc Pro B70 32G Graphics Card Hands On Impressions: Big Battlemage Stuns With Big Uplifts Over B580

The Hot Take: We dearly need this competition...

Intel's Arc Pro GPU journey began with the first-generation Alchemist A-series products, and last year, the company introduced its Battlemage B-Series products. The first generation of products was aimed at the budget segment, offering good perf/$, and while the positioning continues with the Battlemage lineup, it looks like Intel is slightly moving towards a higher-end segment with its Arc Pro B60, B65, and B70 series. This move comes at a time when AI is the talk of the town, and local AI agents are becoming more and more popular. Also, Intel's recent workstation lineup, the Xeon 600 series, makes getting […]Read full article at https://wccftech.com/review/maxsun-intel-arc-pro-b70-32g-graphics-card-hands-on-impressions/

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Intel's upcoming Z970 and Z990 flagship chipsets will reportedly consume up to 14W at peak load, courtesy of more PCIe 5.0 support — Nova Lake motherboards may feature a 22% smaller PCH than Z890

The Hot Take: Question is, do I go HPDT with Z990 or Consumer Z970? I guess I'll have to see the benches on if HPDT does anything for Gaming.

The Z990 PCH for Nova Lake motherboards is apparently 22% smaller than Z890, despite featuring a higher power maximum power draw of up to 14W. The leaked picture of the PCH shows a 11.15 x 6.5mm die and 25 x 24mm package, but we're unsure what motherboard it actually comes from.

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AMD fires back at Nvidia, claiming 256-core Zen 6 'Venice' CPU beats Vera by 3.3x in rack-level performance — company shares first estimated EPYC Venice benchmarks

The Hot Take: CISC muscle on display... When you don't care about how many watts your cpu consumes ARM/RISC will never touch the raw throughput of these chips.

AMD has shared the first official results for its 256-core EPYC Venice CPU, saying it beats Nvidia's Vera by 3.3x in a rack-level deployment.

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